Industry Directory: 20um (1)

CVInc.

Industry Directory | Manufacturer

CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.

New SMT Equipment: 20um (7)

Koh Young KY8080 3D SPI

Koh Young KY8080 3D SPI

New Equipment | Test Equipment

Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808

Qersa Technology Co.,ltd

KOH YOUNG Zenith UHS 3D AOI

KOH YOUNG Zenith UHS 3D AOI

New Equipment | Test Equipment

KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t

Qersa Technology Co.,ltd

Electronics Forum: 20um (11)

micro assembly technology inc. dispensing at 20um resolution

Electronics Forum | Thu Nov 18 02:53:31 EST 2004 | galp

Chack this contact "micro Assembly technology" tel: +972-4-9592225

micro assembly technology inc. dispensing at 20um resolution

Electronics Forum | Thu Nov 18 07:02:14 EST 2004 | davef

Cntinuing with the previous thread: http://www.mat-ltd.com/

Used SMT Equipment: 20um (9)

Koh Young Zenith XL

Koh Young Zenith XL

Used SMT Equipment | AOI / Automated Optical Inspection

Zenith 3D AOI  8 Direction 8 Projection Canera Resolution : 8 Mega/20um  Inspection PCB Size : 850 x 690 mm Very good Working Condition. Q'ty :4 Systen

INSPECTION TECH

Omron VT-RNS2-L

Omron VT-RNS2-L

Used SMT Equipment | AOI / Automated Optical Inspection

OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti

Qinyi Electronics Co.,Ltd

Industry News: 20um (9)

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

MES Jump Starts 2014 with NEW Laser Cutting Stencil System

Industry News | 2014-01-10 19:59:46.0

MES Jump Starts 2014 with NEW Laser Cutting Stencil System.

Metal Etch Services, Inc.

Parts & Supplies: 20um (4)

Technical Library: 20um (1)

Developments in Electroless Copper Processes to Improve Performance in amSAP Mobile Applications

Technical Library | 2020-09-02 22:02:13.0

With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications

Atotech

Videos: 20um (13)

ML-A410  SMT Automated Optical Inspection Machine

ML-A410 SMT Automated Optical Inspection Machine

Videos

ML-A410  SMT Automated Optical Inspection Machine  Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.

Qinyi Electronics Co.,Ltd

3D SPI manufacturer

3D SPI manufacturer

Videos

Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the

CNSMT CO.LTD

Express Newsletter: 20um (2)

Partner Websites: 20um (16)

SMT Koh Young KY8030-3 SPI inspection machine

| https://www.feedersupplier.com/sale-13018909-smt-koh-young-ky8030-3-spi-inspection-machine.html

Offset, Coplanarity Inspection Performance Camera Resolution 10um 15um 20um FOV Size 20x20mm (0.79x0.79 inch) 30x30mm (1.18x1.18 inch) 40x40mm (1.57x1.57 inch) Full 3D Inspection Speed

SMT Reflow Oven Reflow soldering process-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmi

| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print

(Sn 99%, Ag 0.3%, Cu 0.7%) alloy,Make the SnAgCu to the small balls(1#?2#:75-150um?3#:25-45um,4#:20-38um?5#:10-20um) and mixed it with the flux


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