Industry Directory: 20x (6)

Micro Dynamics Corp

Industry Directory | Manufacturer

Micro Dynamics has been an employee-owned Electronic Manufacturing Services provider since 1981.

All Flex Flexible Circuits, LLC

Industry Directory | Manufacturer

Flexible circuit manufacturing and assembly. 20 years experience.

New SMT Equipment: 20x (112)

KOH YOUNG Zenith UHS 3D AOI

KOH YOUNG Zenith UHS 3D AOI

New Equipment | Test Equipment

KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t

Qersa Technology Co.,ltd

Framed SMT Stencil

Framed SMT Stencil

New Equipment | Solder Paste Stencils

BEST designs and faricates a variety of different-sized metal stencils in a variety of differnt types of frames. The metal stencils are either formed Aluminum or cast steel. The most common sizes are 29 x 29" or 20 x 20" frames. We have many years of

BEST Inc.

Electronics Forum: 20x (74)

DEK Printers

Electronics Forum | Fri Feb 27 07:59:47 EST 2004 | cyber_wolf

Is it true that a DEK printer will not accept a standard 20X20 stencil. I have heard that the image on the stencil is offset as well.(you need special stencils just for DEK printers?) Do they make an adapter to accommodate standard 20X20's with cent

DEK Printers

Electronics Forum | Fri Feb 27 12:06:03 EST 2004 | jseagle

A 20 x 20 frame with the image centered will drop in IF you have a printer with adjustable rails for the stencil, the rails move in and out to accomodate 29 x 29 to smaller than 20 x 20. Otherwise, you will need the adapter. James

Used SMT Equipment: 20x (142)

MPM Ultraprint2000

MPM Ultraprint2000

Used SMT Equipment | Screen Printers

MPM, Screen Printer, type UP 2000/B , s.n. 22256, size Approx 1,17 x 1,60 x 1,50 meters , max plate 20' x20', with CRT monitor and internal PC, CE Marked

Baja Bid

Orbotech Trion 2340

Orbotech Trion 2340

Used SMT Equipment | AOI / Automated Optical Inspection

ORBOTECH, Visual inspection machine, type TRION 2340, s.n. 0601265, with 3D edge detection, included DELL PC inside and flat monitor HP, size approx. 1,20x1,25x,1,60 meters, year 2001

Baja Bid

Industry News: 20x (146)

DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

SMTnet

Optilia’s Unique FreeSight Digital Video Inspection Systems Highlight Booth #219 at SMTAI 2016

Industry News | 2016-09-01 19:37:25.0

Optilia’s unique FreeSight Digital Video Inspection systems will be featured in Booth #219 at SMTAI 2016. FreeSight provides the ability to view and work on objects at high magnification at an amazing extended 500mm of working distance for maximum comfort and ergonomics. Booth #219 is under Ascentech LLC, the North American Distributor for Optilia Instruments AB. The SMTA International Conference and Exhibition takes place September 27-28 at the Donald Stephens Convention Center in Rosemont, IL.

Optilia Instruments AB

Parts & Supplies: 20x (3443)

Technical Library: 20x (1)

Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs

Technical Library | 2020-08-27 01:22:45.0

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.

Teledyne DALSA

Videos: 20x (58)

Siemens Z-Drive compl 03058631S05

Videos

03002801-02 SIPLACE AXIS Testing Complete    03002842-01 Klettostar-Flausch 20x80    03002870-04 PCB / HEAD ADAPTER C+P 20    03002874-01 ADAPTER FOR SAT KSP-A360    03002876-01 SHORT STROKE ZYLINDER 20x10    03002898-02 ENTERING GUIDE FEEDER /X

Qinyi Electronics Co.,Ltd

Siemens SLEEVE HEAD 00352957-04

Videos

03002801-02 SIPLACE AXIS Testing Complete    03002842-01 Klettostar-Flausch 20x80    03002870-04 PCB / HEAD ADAPTER C+P 20    03002874-01 ADAPTER FOR SAT KSP-A360    03002876-01 SHORT STROKE ZYLINDER 20x10    03002898-02 ENTERING GUIDE FEEDER /X

Qinyi Electronics Co.,Ltd

Express Newsletter: 20x (13)

Partner Websites: 20x (432)

YAMAHA CABLE KH2-M661A-20X | QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/kh2-m661a-20x-cable-210735?page=206&order=name+asc

YAMAHA CABLE KH2-M661A-20X | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products CABLE Public Pricelist Public Pricelist CABLE

Qinyi Electronics Co.,Ltd

4022 516 04940 Assembleon Zxs01a Retaining Wafer 8mm Assembleon Smt Spare Parts

| https://www.feedersupplier.com/sale-14394483-4022-516-04940-assembleon-zxs01a-retaining-wafer-8mm-assembleon-smt-spare-parts.html

) KV7-M81D0-00X KV7-M7740-A0X Emerald 64, copy new KV7-M7740-A0X KGB-M7181-00X BELT, HEAD R Axis, original new KGB-M7181-00X KM1-M7163-30X - Topaz Vacuum Valve, original new KM1-M7163-30X KM1-M7163-20X


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