New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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Electronics Forum | Tue Jun 06 13:19:31 EDT 2000 | ZAKIR AHMAD
Our company do electronic packaging for space applications. One of the problems we face during our design is whether or not to stake/bond the surface mount components to the board to survive the vibration qualification environment. If we do staking
Electronics Forum | Mon Jan 18 15:07:12 EST 2010 | mikesewell
Usually the print specifies the material since the design is qualified with it in place. I've used several from Scotchweld 2216, Scotchweld DP190, Hysol E-20HP, to NASA outgassing qualified Masterbond 10HT.
Industry News | 2017-10-31 18:25:33.0
STI Electronics is pleased to announce the recipient of the 2017 Jim D. Raby Scholarship. This year’s recipient was Broxton Sanderson, a student at the local Calhoun Community College with locations in Decatur and Huntsville, AL.
Industry News | 2020-10-19 14:28:43.0
STI Electronics, Inc. is pleased to announce the recipient of the 2020/2021 Jim D. Raby Scholarship. This year's recipient was Emery "Graham" Goff, a student at Calhoun Community College with locations in Decatur and Huntsville, AL. Graham is majoring in Advanced Manufacturing Technology.
Parts & Supplies | Tape and Reel
Black anti-electrostalic tape 1. The splice tape can be greatly improved production efficiency. 2. It is great of avoid waste of materials. 3. It can be avoided due to the flip switch may be caused by man-made incidents.
Parts & Supplies | Other Equipment
SIEMENS 6ES73401AH008BA CP340 COMM MOD SIEMENS 6ES73401AH008CA CP340 COMM MOD SIEMENS 6ES73401AH008EA CP340 COMM MOD SIEMENS 6ES73401AH010AE CP341 COMM MOD SIEMENS 6ES73401AH017EA CP341 COMM MOD SIEMENS 6ES73401BH000AE CP341 COMM MOD SIEMENS 6E
Technical Library | 2023-08-16 18:48:50.0
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ Manufacturer Rockwell Automation Part Number/Catalog No. 1794-ACN15 Brand Allen-Bradley Produc
TE Connectivity New and Original MS25036-102 in Stock IC Terminal , 21+ package MS25036-102 Terminal PIDG 22-16 XC6SLX150-3FGG484C BGA XILINX 20+ XC6SLX100-3FGG484C BGA XILINX 14+ XC6SLX25-2FTG256C BGA XILINX 21+ XC6SLX45-2
Events Calendar | Wed Jan 20 00:00:00 EST 2021 - Fri Jan 22 00:00:00 EST 2021 | Tokyo, Japan
PWB EXPO - Printed Wiring Boards Expo
46877 | https://www.nordson.com/zh-CN/divisions/polymer-processing-systems/products/feedblocks-co-extrusion?con=t&page=2216
ASYMTEK Products | Nordson Electronics Solutions
