BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP
I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s
Electronics Forum | Thu Mar 05 07:49:00 EST 1998 | Steve Gregory
Hi Ron, Your question really opens up a "Pandora's box", but when you say you're not able to print perfectly, what is it exactly that you mean? Is the print lacking volume? Is it mis-registered? Are you bridging? Also, what printers have you used? Do
Used SMT Equipment | Chipshooters / Chip Mounters
=1) Vision recognition ±0.04mm Feeder inputs Max. 80 on 8mm T/F*6 *1 Please ask for details on E size board. *2 When using MNVC. (option) *3 When using both high-resolution camera and MNVC. (option) *4 Effective
Industry News | 2011-03-28 11:42:40.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.
