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Electronics Forum | Thu Nov 15 13:46:28 EST 2001 | Terry Burnette
Underfilling PBGA's will increase the PCB level solder joint life by 4x-5x but we only recommend underfill for products going into extreme environments. Normally the 272ld and 388ld PBGA's solder joints when cycled at -40C to +125C should not see any
Electronics Forum | Fri Dec 08 14:03:52 EST 2000 | Roland
Andrea, There are many good sources for this info. One I suggest can be found at http://www.gii.co.jp/english/ab4031_yy_pcb.html. I hope this helps! Roland
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Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers
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