Industry Directory | Manufacturer
Manufacturers of Automated Optical Inspection
Industry Directory | Manufacturer / Other
Gen Pack Assembly is a contract electronics manufacturer providing PCB assembly, testing, and box-build integration for your mid volume & high mix productions. A trusted partner for over 25 years, Gen Pack is proudly ISO:9001
New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
Electronics Forum | Fri Mar 09 01:48:26 EST 2018 | aemery
Unfortunately Gerber EZ is probably the one thing I know very little about. As an FSE with Speedline I only had one client at that time that was using it and an application engineer came in and helped them with it. Sorry I can't give a direct answer
Electronics Forum | Thu Apr 26 01:14:42 EDT 2007 | JJ
Hi all, We plan to buy solder paste height measurement machine. However, not sure which is the better one..2D or 3D? As far as I know,3D is quite slow and but more accurate in term of measurement result. Pls share with me if anyone who has this e
Used SMT Equipment | Screen Printers
2005 Speedline Accuflex Screen Printer - WATCH VIDEO LINK(S) - Power: 110V; 5A; 60Hz Serial: MMI-100320 Features: O/S: Windows 2000; S/W: 8.4.2 2D Post Solder Inspection Stencil Wipe SMEMA
Used SMT Equipment | Screen Printers
2007 Speedline Accuflex Screen Printer - WATCH VIDEO LINK(S) - Power: 110V; 5A; 60Hz Serial: AFMMI-100701 Features: O/S: Windows 2000; S/W: 8.6.0 Automatic Tooling 2D Post Solder Inspection Stencil Wipe; SMEMA Solder Paste Dispenser
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Parts & Supplies | SMT Equipment
Yamaha Mini Steel YV64D Yamaha Dispenser Nozzle YV64D series nozzles: 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE) 2 K37-M7113-10X YV86/YV100D DISP.NZ. 1D/1S(FOR ADHESIVE) 3 K37-M7113-00X YV86/YV100D DISP.NZ. 2D/1S(FOR ADHESIVE)
Parts & Supplies | SMT Equipment
Yamaha Mini Steel YV64D Yamaha Dispenser Nozzle YV64D series nozzles: 1 K37-M7113-20X YV86/YV100D DISP.NZ. 1D/1S(FOR SOLDER PASTE) 2 K37-M7113-10X YV86/YV100D DISP.NZ. 1D/1S(FOR ADHESIVE) 3 K37-M7113-00X YV86/YV100D DISP.NZ. 2D/1S(FOR ADHESIVE)
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2008-05-28 18:41:53.0
This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
The Industry Requirement for 2D and 3D Inspection Technology in a Single AOI Platform SMTnet Express November 21, 2012, Subscribers: 26000, Members: Companies: 9045, Users: 33968 The Industry Requirement for 2D and 3D Inspection Technology in a
Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual
winsouce.jpg)
