Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
• Wafer-level chip scale packages (WLCSP) • BGA and CSP inspection. • Non-lead solder inspection. Micro-electro-mechanical systems (MEMS, MOEMS) Cables, harnesses, plastics and many more 7 Geldenaaksebaan 329 B-3001 Leuven, Belgium phone
winsouce.jpg)