Electronics Forum | Wed Sep 22 22:35:00 EDT 2004 | davef
From your question, it's difficult to determine the purpose of the time you are measuring: * Throughput * Cost Good luck
Electronics Forum | Fri Mar 23 08:35:00 EDT 2018 | spoiltforchoice
Between those two I think you have already been given the answer.
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Technical Library | 2019-09-23 09:35:00.0
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility that inadvertent damage can occur through the course of the analysis. If non-destructive testing is preferred, then the following types of analysis can be performed. The testing can be divided into four categories: visual, X-ray (X-ray imaging and X-ray fluorescence), cleanliness (resistivity of solvent extract, ion chromatography, and Fourier transform infrared spectroscopy), and mechanical (non-destructive wire bond pull).
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