Industry Directory | Manufacturer
We offer full turnkey services for quick turnaround prototypes and production orders. ***Min 0.1mm via; ***Min 0.4mm board; ***Max 16oz copper; ***Min.line width/space:3/3mil; ***With blind and burie
Industry Directory | Manufacturer
Circuits, LLC is a quality-driven, customer-focused manufacturer of highly reliable built-to-spec flexible printed circuit boards serving the defense, industrial, and medical markets.
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Test voltage: 50 to 300V
Electronics Forum | Wed Feb 14 15:43:33 EST 2007 | CK the Flip
5/3 mil as in... 5 mils stepped down to 3 mils?
Electronics Forum | Thu Apr 29 09:37:12 EDT 1999 | Dave F
| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. | Daniel: 2 mil lines with 3 mil spaces are pretty technical. Good luck. Dave F
Used SMT Equipment | Pick and Place/Feeders
Universal Advantis 4982C Placement machine 2006 Model 7 spindle Flexjet 1 head Qty 1 Flex head Camera- Front ULC Magellan 2.3 mil per pixel (upward-looking) Placement Count: 5 million Clean, checked out. Video available
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Parts & Supplies | Pick and Place/Feeders
GSM Multi Pitch Feeder 16mm 47175802 we also supply other Universal accessories (GSM): part no description 46485701 CAMERA(PEC) 45269201 PC BD,PEC ILLUM ASSY 47598301 FLEXJET CLUTCH (OLD) 50121203 FLEXJET MirrorCLUTCH(NEW) 47509501 THETA ENCOD
Parts & Supplies | Other Equipment
AI universal parts 40727505 46737003 SCRAP HOUSING ASSY, OFFSET 46737103 SCRAP HOUSING ASSY, "T" STYLE 46750601 COVER, CLINCH OFF 46750901 COVER, CLINCH VSL 46757801 PICKER AXIS MTR ASSY 46757901 X AXIS MTR ASSY 46758001 Y AXIS MTR ASSY 467
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
