New Equipment | Assembly Services
The board is designed by customer and it's for Air Purification control PCBA board. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 2 Layer PCBA board Material: FR-4 Thicknss:
New Equipment | Assembly Services
The board is designed by customer and it's for Power Bank PCBA board. We did one-Stop EMS Service for this project (PCB manufacture, components sourcing, SMT and THT assembly): Product name: 2 Layer PCBA board Material: FR-4 Thicknss: 1.6mm Surface:
Electronics Forum | Mon May 19 10:35:58 EDT 2008 | samir
I agree with RealChunks. The application of any of these "wave solder process control tools" is dependant on how the shop is run. At some shops, PM is inconsistent and slacked off on. At other shops, there is no technical expertise at the operator
Electronics Forum | Thu Jul 08 04:26:27 EDT 2010 | bks
Hello, this is my first post in this forum, but sometimes I visit it to get some news. Now we have an issue and I need your advice. Few months ago we were awarded with a project that use PTH components. We solder these components on Wave soldering
Used SMT Equipment | Soldering Equipment/Fluxes
WANTED: Electronics Manufacturing Company seeking Wave Soldering Equipment in good condition w/ the following features: 1. Convection Pre-Heating; 2. 2-3 zones: Bottom & Top 3. Auto Lead Clearance Adjustment [recipe driven auto pot height adj
Industry News | 2003-04-10 07:58:34.0
The answers that you need to stay competitive in today's market
Industry News | 2017-02-16 15:18:04.0
Nihon Superior announces that it has been awarded a 2017 NPI Award in the category of Soldering Materials for its SN100CV P506 D4 Lead-Free Solder Paste. The award was presented to the company’s President, Tetsuro Nishimura during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Technical Library | 2018-05-17 11:14:52.0
Intermetallic compound (IMC) growth is being studied in earnest in this past decade because of its significant effect the solder joint reliability. It appears that from numerous investigations conducted, excessive growth of IMC could lead to solder joint failure. Leading to this, many attempts has been made to determine the actual IMC thickness. However, precise and true representation of the growth in the actual 3D phenomenon from 2D cross-section investigations has remained unclear. This paper will focus on the measuring the IMC thickness using 3D surface profilometer (Alicona Focus G4). Lead free solder, Sn3.0Ag0.5Cu (SAC305) was soldered onto copper printed circuit board (Cu PCB). The samples were then subjected to thermal cycle (TC) storage process with temperature range from 0 °C to 100 °C for 200 cycles and up to 1000 cycles were completed.
Career Center | Fort Lauderdale, Florida USA | Production
Manufacturing / SMT Process Engineer ESSENTIAL DUTIES & RESPONSIBILITIES include the following. Others may be assigned. � Conceive, develop, document, and implement manufacturing processes for PCB assembly � Creates and maintains process instruc
SMTnet Express, May 17, 2018, Subscribers: 31,044, Companies: 10,939, Users: 24,723 Statistical Aspect on the Measuring of Intermetallic Compound Thickness of Lead Free Solders Azman Jalar, Maria Abu Bakar, Roslina Ismail, Abdul Razak Daud
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/cm-chip-inductor-4lead_topic1454.html
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