Industry Directory | Manufacturer
A leading manufacturer of packaging products for the surface mount component industry.
Offering superior reliablity and optimum performance, Hover Davis Icon Series features large tape format, deep component pocket capability, optional large reel capacity, positive latching tape cover and an ergonomic handle. BENEFITS: - Smaller profil
All carrier tapes are designed to meet all current EIA 481 standards. KEACO manufactures carrier tape from 8mm to 88mm in width with deep pocket capabilites. Standard two week concept to production lead times for custom carrier tapes. Expedited to
Electronics Forum | Fri Mar 30 09:43:08 EDT 2007 | Rob
I'm with you on the Metcals, however, you will need very deep pockets for the tips.
Electronics Forum | Tue Nov 18 13:34:00 EST 2014 | dontfeedphils
http://www.mentor.com/pcb-manufacturing-assembly/ If you've got deep pockets.
Used SMT Equipment | Pick and Place/Feeders
High speed flexible mounter. New in 2012. The machine is in excellent condition with nozzles and over 50 feeders. Has optional long board option installed by Juki. 8588 Hours. Feeder count is: 8mm: 20; 12mm: 25; 16mm: 5, 1 deep pocket; 24mm: 3, 1 dee
Used SMT Equipment | Pick and Place/Feeders
GSM 32mm deep pocket 3 pcs GSM 44mm deep pocket 2 pcs Ex-stock, Penang. Elexin Engineering
Industry News | 2012-12-03 11:35:40.0
Count On Tools Inc. (COT) introduces additional accessories for its revolutionary StripFeeder System for loading tape-and-reel components onto compact modules for prototype and high-mix/low-volume applications.
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Parts & Supplies | Pick and Place/Feeders
Panasonic cm402/602 44/56mm 72mm deep pocket feeders
Parts & Supplies | Pick and Place/Feeders
JUKI 32mm deep pocket feeder FF32FR-OP E6000706RBC Other juki feeders in stock: JUKI feeder AF05HP E1001706AB0/JUKI feeder AF12FS E3003706AB0 JUKI feeder AF16FS E4003706AB0/JUKI feeder AF16NS E4004706AB0 JUKI feeder AF24FS E5005706AB0/JUKI feeder
Technical Library | 2023-07-25 16:25:56.0
This paper address two significant applications of stencils in advance packaging field: 1. Ultra-Thin stencils for miniature component (0201m) assembly; 2. Deep Cavity stencils for embedded (open cavity) packaging. As the world of electronics continues to evolve with focus on smaller, lighter, faster, and feature-enhanced high- performing electronic products, so are the requirement for complex stencils to assemble such components. These stencil thicknesses start from less than 25um with apertures as small as 60um (or less). Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and the pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 15um-40um with steps of 15um are used to obtain desired print volumes. Stencils with thickness to this order can be potential tools even to print for RDLs in the package.
