New SMT Equipment: 484 bga (1)

Allen-Bradley 1771-DXPS Expander Module

Allen-Bradley 1771-DXPS Expander Module

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M

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Electronics Forum: 484 bga (4)

BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire

Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a

BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire

Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a

Videos: 484 bga (107)

TI New and Original TPA3129D2DAPR in Stock  IC HTSSOP-32, 21+     package

TI New and Original TPA3129D2DAPR in Stock IC HTSSOP-32, 21+ package

Videos

TI New and Original TPA3129D2DAPR in Stock  IC HTSSOP-32, 21+     package TI New and Original TPA3129D2DAPR in Stock  IC HTSSOP-32, 21+     package Today's Hot Deals: DR331-513AE SOP-4 BOURNS 19+ 61300211121 NULL WURTH 17+ TJA1043TK/1Y HVSON14 N

Shenzhen Fuwo Technology Co.,Ltd

TI New and Original SN74LV595ARGYRG4  in Stock  	IC SHIFT REG 8BIT TRI-ST 16-VQFN, 2021+      package

TI New and Original SN74LV595ARGYRG4 in Stock IC SHIFT REG 8BIT TRI-ST 16-VQFN, 2021+ package

Videos

TI New and Original SN74LV595ARGYRG4  in Stock  IC SHIFT REG 8BIT TRI-ST 16-VQFN, 2021+      package TI New and Original SN74LV595ARGYRG4  in Stock  IC SHIFT REG 8BIT TRI-ST 16-VQFN, 2021+      package TI New and Original SN74LV595ARGYRG4  in Stock

Shenzhen Fuwo Technology Co.,Ltd

Express Newsletter: 484 bga (449)

Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment

Surface Insulation Resistance Testing. Results of Independent Testing for Best Inc. BGA Stencil Repair Rework Samples Solder Paste Reattachment If you don't see the images, please visit online version at #Application


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