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Electronics Forum | Tue Sep 14 04:50:02 EDT 2004 | Base
Try Tecnomatix, Aegis and maybe Valor. They all (say they) have interfaces to the equipment vendor's optimizers.
Electronics Forum | Wed Sep 19 11:50:02 EDT 2007 | stepheniii
nevermind misread the post. But if the silkscreen is too thick, can you switch to another PCB manufacturer?
Used SMT Equipment | Chipshooters / Chip Mounters
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Industry News | 2012-01-17 11:50:02.0
ACD will highlight its test capabilities in Booth #777 at the Medical Design & Manufacturing West Exposition, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in California.
Industry News | 2014-04-30 16:50:02.0
Microtek Laboratories will exhibit in Booth 54-02 at the JPCA Show, scheduled to take place June 4-6, 2014 at the Tokyo Big Site in Japan.
Parts & Supplies | Pick and Place/Feeders
SIEMENS_smt_feeder_parts_for_ht_msr
Technical Library | 2016-10-07 12:50:02.0
15 points to consider when about to purchase a new oscilloscope
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
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