Electronics Forum | Fri Dec 14 08:55:40 EST 2018 | davef
Some breadcrumbs for you ... Orbotech: In 2009, Orbotech's Assembly Automated Optical Inspection (AOI) division, which had been started in 1997 by the acquisition of Schuh GmbH, was spun off into a separate company, ORPRO Vision GmbH, which was then
Electronics Forum | Fri May 24 09:19:02 EDT 2019 | davef
http://www.nordsonselect.com. Accel: Cookson created Speedline after purchasing: MPM®, Electrovert®, Accel®, and Camalot®. In 2003, KPS Special Situations Fund II purchased Speedline from Cookson. In, 2007, Illinois Tool Works ITW acquired Speedlin
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Industry News | 2011-07-13 15:34:21.0
Multitest announces that Reinhart Richter has been promoted to President of the Multitest Group effective immediately.
