New Equipment | Solder Materials
NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time
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New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
Electronics Forum | Mon Jul 03 07:30:14 EDT 2000 | steve
DOES ANYONE HAVE EXPERIENCE USING THE S-2000 MACHINE FROM MANNCORP. IT IS A SAMSUNG BASED MACHINE. ANY COMMENTS WOULD BE APPRECIATED.
Electronics Forum | Thu Mar 10 06:57:02 EST 2011 | ravo
yea SR.TEC, am suffring right now from trying to assemble BGA 676 pins with my QP242
Used SMT Equipment | SMT Equipment
1.) XP143E SN : 630 Vintage 2005 Pics : http://www.slimtech-smt.com/XP143E-SN-630/ 2.) XP143E SN : 676 Vintage 2005 Pic
Used SMT Equipment | Repair/Rework
Metcal APR-5000 BGA/SMD Rework System. Complete with large assortment of BGA/SMD nozzles and full compliment of spares. Fully inspected and total system maintenance/calibration performed on Dec 13. System is like new with low mileage, works perfectly
Industry News | 2016-08-08 20:27:23.0
Engineered Materials Systems is pleased to introduce its new EMS 561-676 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-676 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.
Industry News | 2010-10-26 22:46:06.0
FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.
Parts & Supplies | Pick and Place/Feeders
2-679-676-11 Sony Convey Belt Brand:: SONY MODEL: SONY 2-679-676-11 Weight:: 10g Lead Time:: 1-2days Packing:: Paper BOX PAYMENT TERM: T/T, Paypal, Westernunion Are All Allowed ZK Electronic Technology Co.,Limited becky@hysmt.cn skype:beckys
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Parts & Supplies | Pick and Place/Feeders
KXF0DXJBA00 GUMMED PAPER Paper 20MM*360MM*375MM*10M ..N610118451AA LOCK FOR PAPER N610003142AA PAPER ROLL 676MM*670MM*15M*26MM*20MM ..MTNZ000171AA Block for paper ..INTF-006E
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Dyfenco | Soldering Flux For Electronic Assembly | Solder Material Supplier | Solder Material Manufacturer | Made in Taiwan Contact us: Dyfenco International Co., Ltd. Phone: +886-7-6160317 ext.927 Mobile/WhatsApp/WeChat/Zalo: +886-952 715 676 E
Product name: SMT Adhesive - AR Series Adhesive Brand: Dyfenco Origin: Taiwan Feature: - Stable adhesive strength - Fast heat cure - Strong tack - Wide processing window - Excellent electrical characteristics ________________________________
SMTnet Express, January 3, 2019, Subscribers: 31,567, Companies: 10,676, Users: 25,564 Risk Mitigation in Hand Soldering Credits: Metcal Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding
50051 | http://www.kundasmt.com/a/PRODUCTS/676.html
KD Electronics Ltd.
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