Used SMT Equipment | In-Circuit Testers
Configuration: (1) PC (1) Keyboard, (1) Mouse & (1) Display (1) MTG Card [PN 9004-0108]] (1) HSC Card [PN 2277-4711] (1) CST Card [PN 2277-4712] (1) DS Reference Card [9004-0406] (6) Combo 2 Cards [PN 2277-4021] (1) Combo 2a Card [PN 9004-022
Used SMT Equipment | In-Circuit Testers
Genrad 2286E-9723 In-Circuit Tester Configuration: (1) MTG [9004-0108]; (1) HSC [2277-4711] (1) CST [2277-4712]; (1) DS Ref [2277-4750] (14) Combo 1 [2277-4020] (1) Combo 1a [9004-0475] (1) AFTM [9004-0040]; (2) 0-7V P/S (6) 0-20V P/S; (1) 0-
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
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