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We are your obsolete industrial product specialists. Our inventory includes VME, cPCI, ATCA, SBCs and much more industrial electronics
Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a
Panasonic KME CM402/602 machines feeder, MSF,HT,BM machines feeder 8mm Tape Feeder KXFW1KS5A00 with sensor 8mm TapeFeeder KXFW1KSBA00 without sensor， 12/16mm Tape Feeder KXFW1KS6A00 with sensor, 24/32mm Tape Feeder KXFW1KSDAOO without sensor 2
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Electronics Forum | Thu Apr 18 17:30:09 EDT 2002 | davef
It's a reasonable recommendation. Look here http://www.safetyinfo.com/safetyinfo/html/aa-guest-info/s-talk-chem-bonding.htm These will get you started: * http://www.princeton.edu/~ehs/labmanual/sec7-2.html * http://www.ccohs.ca/oshanswers/prevent
Used SMT Equipment | In-Circuit Testers
Genrad 2286E-9723 In-Circuit Tester Configuration: (1) MTG [9004-0108]; (1) HSC [2277-4711] (1) CST [2277-4712]; (1) DS Ref [2277-4750] (14) Combo 1 [2277-4020] (1) Combo 1a [9004-0475] (1) AFTM [9004-0040]; (2) 0-7V P/S (6) 0-20V P/S; (1) 0-
Used SMT Equipment | In-Circuit Testers
1 – 3070 In-Circuit Tester (E1026A) 1 – Controller (HP5700 “Windows”) 2 – ASRU C Cards 2 – Control Xt Cards 18 – Hybrid Double Density Cards 2 – 6624 Power Supplies 1 – Keyboard, Mouse & Printer Software version (Unix) 05.21pd 0103 UX Softwa
Industry News | 2012-05-11 20:35:45.0
Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
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Parts & Supplies | Screen Printers
Product Name: P9246; P2230; P9229; P10567 mouse ball Part Number: P9246; P2230; P9229; P10567 Description: P9246; P2230; P9229; P10567 mouse ball Applicable models: UP; AP Printing Presses P9246; P2230; P9229; P10567 mouse ball Power, Tra
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Parts & Supplies | Screen Printers
Product Name: P9246; P2230; P9229; P10567 mouse ball Part Number: P9246; P2230; P9229; P10567 Description: P9246; P2230; P9229; P10567 mouse ball Applicable models: UP; AP Printing Presses P9246; P2230; P9229; P10567 mouse ball Power, Tra
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati
J9065331A TAPE GUIDE 0603 ASSY J9065177A TAPE GUIDE 2P ASSY J9065178A TAPE GUIDE 4P ASSY J9065179A
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Jun 12 00:00:00 EDT 2024 - Wed Jun 12 00:00:00 EDT 2024 | ,
SMTA Webinar: Translating the Technology, a "Cross-Over" Event - Ultra HDI
Events Calendar | Wed Mar 13 00:00:00 EDT 2024 - Wed Mar 13 00:00:00 EDT 2024 | ,
SMTA Technical Webinar: Translating the Technology, a "Cross-Over" Event - High Reliability
Career Center | bbsr, orissa India | Technical Support
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Career Center | , | 2001-05-17 22:28:23.0
Myers & Associates has been retained to identify an executive to manage a large, multi-site contract manufacturing operation. Prior experience in SMT contract manufacturing required. P&L experience required.
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
SMTnet Express, December 16, 2021, Subscribers: 26,148, Companies: 11,476, Users: 26,983 Assembly and Rework of Lead Free Package on Package Technology Miniaturization continues to be a driving force in both integrated circuit
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/material/plural-components-2k-3k?con=t&page=1
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/difference-b-w-a-blank-pcb-and-pcb-with-components_topic2834_post11254.html
Difference B/W a Blank PCB and PCB With Components - PCB Libraries Forum Forum Home > Training / Events > PCB Design Basics New Posts FAQ Search Events Register Login Difference B/W a Blank PCB and PCB With Components
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