Industry Directory: acf bond (5)

Toddco3

Industry Directory | Manufacturer

Toddco3 manufactures automated assembly equipment for the electronics industry that ACF bonds, solders or welds flexible circuits, glass, PCBs or metals.

Microjoin

Industry Directory | Manufacturer

Microjoin specializes in offering microwelding, heat seal, hot bar and welding assembly equipment used in bonding and microjoining of miniature mechanical and electrical sub-assemblies.

New SMT Equipment: acf bond (6)

ACF Bonding

New Equipment | IC Packaging

Pulsed Heat Hot Bar Bonders, Computerized Control Systems, FPD Workstations

Microjoin

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

New Equipment | Assembly Services

TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left

Toddco3

Electronics Forum: acf bond (8)

RISKS OF ACF BONDING

Electronics Forum | Mon Jul 22 05:01:42 EDT 2002 | Comrade

Can anybody highlight the risks of implementing ACF bonding other than it is expensive and difficult to perform ??

ACF bonding

Electronics Forum | Fri Sep 25 00:39:31 EDT 2015 | jana

Does anyone use bonding with ACF( anisotropic conductive film)?

Industry News: acf bond (14)

Desktop Systems Provide Flexible Bonding

Industry News | 2003-06-10 08:39:25.0

New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.

SMTnet

Nordson ASYMTEK's Next Generation Dispensing and Conformal Coating Systems and Software to be on Display at IPC APEX 2016 Booth 1841

Industry News | 2016-03-09 16:11:24.0

Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.

ASYMTEK Products | Nordson Electronics Solutions

Express Newsletter: acf bond (127)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding


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convection smt reflow ovens

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High Throughput Reflow Oven

High Throughput Reflow Oven
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