Industry Directory | Manufacturer
Largest manufacturer of Stationary Lead Acid Batteries from 2.5Ah to 12000Ah for backup & control power.
Industry Directory | Manufacturer
We are specialized in supplying fine chemicals, bulk pharmaceuticals , pharmaceutical intermediates. Our Chemicals such as glyoxylic acid, glyoxal, Chloroacetone, Phenoxyethanol, Pyruvaldehyde etc
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
New Equipment | Assembly Services
> 6Spindle, 6 Flying Vision (FOV 24mm) Head -Batch recognition with 6 cameras while picking up 6 components -Processable components: 0402 ~ 21mm, H12mm >> Low-noise, low-vibration high-speed placement with Linearmotor -Suitable for Y-axis Linear Moto
Electronics Forum | Thu Nov 06 00:41:43 EST 2003 | Mike Konrad
Consider adding measured amounts of muriatic acid to the holding tank. Muriatic acid is used as a pH reducer and is available at pool supply stores. An alternative to muriatic acid is granular sodium bisulfate, also available at some pool supply st
Electronics Forum | Thu Jul 25 14:32:55 EDT 2019 | bulur
What does flux acid value means in SMD and PTH applications? Is it higher acid values better for each application?
Used SMT Equipment | Soldering - Selective
This machine will be coming available for purchase soon. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: Version
Used SMT Equipment | Board Cleaners
Aqueous degreaser cleaner,auto components degreaser,degreaser for ultrasonic cleaning,ultrasonic degreaser,acid corrosion inhibitor,dry film resist stripper
Industry News | 2013-09-10 17:48:54.0
We are happy to announce that we have opened a new Class 10K cleanroom in the NJ facility.
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
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Parts & Supplies | Assembly Accessories
GREASE N510048190AA 6459GREASE N 40032449 Grease (NSL) 80G K48-M3856-00X Grease N510048188AA Grease Gun J1073000000 Grease Gun Kit AWPJ8200 MP Grease 400g N510006423AA Grease LCG100 200g N510048190A
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Parts & Supplies | Pick and Place/Feeders
JUKI Mounter Chain Introduction (1) JUKI Mounter towline shape like a tank chain, composed of a number of unit links, links between the rotation freely. (2) the same series of towline within the high, high, the same pitch, towline width, bending ra
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2024-07-15 17:29:45.0
Description of acid cleaning, what it is and the risks and benefits of using it. Types of metals used for and types of acids.
Nano-copper sintering in formic acid vapor.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
