Innerspec� Technologies, Inc. is dedicated to the design and implementation of EMAT (Electro Magnetic Acoustic Transducer) technology.
Used to inspection materials which do not admit x-ray penetration (e.g. ceramics). Also used in device-level inspection for defects and counterfeit detection.
ERI brings training to your facility. We "tailor" that training to the host firm's needs. A few courses are listed at http://www.equipment-reliability.com/course_outlines.html, but you can also download a PDF version with a complete list of our cours
Electronics Forum | Wed Mar 01 07:45:56 EST 2006 | davef
Consider: * Equipment Inspection acoustic microscope [Scanning Acoustic Microscopy (SAM)] MicroPhotonics 4949 Liberty Lane, Suite 160, PO Box 3129 Allentown PA 18106 610.366.7103 fax 7105 http://www.microphotonics.com * Equipment Inspection acoustic
Electronics Forum | Wed Apr 14 14:48:48 EDT 2010 | davef
It won't work. An acoustic signal can't punch through a BGA. The signals reflect at every interface. So, it works for flip chip, but there are too many interfaces in CSP and BGA. Equipment, Inspection, Acoustic microscope * MicroPhotonics * Sonos
Used SMT Equipment | In-Circuit Testers
Agilent 6653A The 6653A Power Supply is rated at 35 V @ 15 A and features: HP-IB Linear Output Regulation Complete Front Panel Control Calibration and Display Fan-speed control to minimize acoustic noise Low ripple and noise Over-voltage and over
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 3561A The 3561A Dynamic Signal Analyzer is a versatile, single channel, real time spectrum analyzer with applications in electronics, vibration analysis, and acoustics. It's capable of spectrum and network analysis, waveform reco
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Industry News | 2019-11-03 15:33:45.0
Nordson Test and Inspection will exhibit in Hall A2, Stand 445 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. Systems from Nordson DAGE, MATRIX, SONOSCAN AND YESTECH will be available for demonstrations.
Parts & Supplies | Pick and Place/Feeders
PSU f vacuum pump acoustic enclosure
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Parts & Supplies | SMT Equipment
00382488-01 Cover panel, complete 00383025-01 RETROFIT KIT CURRENT LIMITER HF+X 00383211-01 Spare Part Package Docking Unit X 00383297-01 CABLE 00383400-01 Offline Document Archive(ODA) 10-2008 00383485-01 Condensation cooler-housing 0038
Technical Library | 2017-06-15 00:44:19.0
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
Sonix Acoustic Microscope C-SAM #3 UHR2001 Price: $4,500.00 Model Number : C-SAM #3 Serial Number : UHR2001 Manufacturer: Sonix Dimensions: 440x40x50 Condition: Used - Unit powers up and appears to be functional. - Possibly missing transduc
00382488-01 Cover panel, complete 00383025-01 RETROFIT KIT CURRENT LIMITER HF+X 00383211-01 Spare Part Package Docking Unit X 00383297-01 CABLE 00383400-01 Offline Document Archive(ODA) 10-2008 00383485-01 Condensation cooler-housing 0038
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Fri Sep 18 00:00:00 EDT 2020 - Fri Sep 18 00:00:00 EDT 2020 | ,
Defect Detection for Advanced Wafer and Package Devices
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Austin, Texas USA | Engineering
KN Research is assisting it's award-winning high-tech client to fill a Staff Reliability Engineer position. We are seeking an experienced Reliability Engineer with strong skills in hands-on product failure analysis, field failure and internal failur
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
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