New SMT Equipment: aeroflex and 2,5 (10)

Repair and Calibration Services

Repair and Calibration Services

New Equipment | Other

We repair thousands of instruments that are no longer supported by the original manufacturer. We have an extensive parts inventory assuring prompt turnaround times and competitive prices. Test Equipment Connection offers full service N.I.S.T. trace

Test Equipment Connection

Emerson motor and inverter

Emerson motor and inverter

New Equipment | Other

Sync in/out cable, 7 Pin Mini-DIN connector on one end and an 8 Pin Mini -DIN connector on the other, 1.5 ft Length (FM3/4 to FM3/4) SP1201-LCD Unidrive SP with LCD Keypad, 230Vac, Max Cont Output Current (hp): Normal Duty - 5.2A (1.5hp), Heavy Duty

zhengzhou yuzhe electronic technology co.,ltd

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Electronics Forum: aeroflex and 2,5 (16)

Re: smt terms and definitions

Electronics Forum | Sat Dec 11 10:45:08 EST 1999 | tom terlizzi

tried again to dec 11 and it work the first time I don't have my password this time I did so maybe you have to been in a password mode thanks Tom Terlizzi aeroflex

Mydata Pick and place

Electronics Forum | Tue Aug 28 09:53:44 EDT 2001 | Brock

Stefan, I could be wrong but I have a question about every 10th board having a defect. If a machine places 1 million components and a the board has 200 components you arrive at 5000 boards. If every 10th board has a defect, then only 500 boards have

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Used SMT Equipment: aeroflex and 2,5 (5)

Juki 760 Pick and Place machine

Juki 760 Pick and Place machine

Used SMT Equipment | Chipshooters / Chip Mounters

Model :KE-760 Placement speed:Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg jenny@ksunsmt.com

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki KE-760 Pick and Place Machine

Juki KE-760 Pick and Place Machine

Used SMT Equipment | Pick and Place/Feeders

Model :KE-760 Pick and Place Machine Placement speed:Chips:11, 250CPH(0.32sec/chip) Component mount range:1.0x0.5mm~□50mm or 50x150mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg Currently, all the mac

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

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Industry News: aeroflex and 2,5 (66)

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

Industry News | 2023-05-15 17:38:25.0

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.

Association Connecting Electronics Industries (IPC)

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Parts & Supplies: aeroflex and 2,5 (277)

Fuji DCPH0630;DCPH3780  CP8 filter and base

Fuji DCPH0630;DCPH3780 CP8 filter and base

Parts & Supplies | Assembly Accessories

DCPH0630;DCPH3780  CP8 filter and base DCPH3820 DCPH0630  CP7 filter and base H1194D nozzle FUJI XP243  AGFPN8540 nozzle FUJI XP243  H1340A nozzle FUJI XP243  AGFPN8530 nozzle FUJI XP243  H1194C nozzle FUJI XP2

Qinyi Electronics Co.,Ltd

Mirae i pulse pick and place nozzles

Mirae i pulse pick and place nozzles

Parts & Supplies | SMT Equipment

QUALITY OEM MIRAE AND I PULSE SMT NOZZLES Full series are available,few are listed below: Machine Mirae Machine Mirae MX-310,MX-240,MX-110,MPS-1010,MPS-1020,MPS-1025 P/N: A (1005) Des: Nozzle,ø0.65/ø0.38 P/N: A+B (1005~1608) Des: No

Jinchen Electric Technology Co,.Ltd

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Technical Library: aeroflex and 2,5 (3)

High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers

Technical Library | 2017-08-10 01:23:22.0

This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.

Georgia Institute of Technology

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation

Technical Library | 2017-09-14 01:21:52.0

The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...) This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.

Vern Solberg - Solberg Technical Consulting

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Videos: aeroflex and 2,5 (43)

FUJI SMT Pick and Place Machine NXT III

FUJI SMT Pick and Place Machine NXT III

Videos

FUJI SMT Pick and Place Machine NXT III If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine,

Dongguan Intercontinental Technology Co., Ltd.

Pick and Place Machine

Pick and Place Machine

Videos

FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma

Dongguan Intercontinental Technology Co., Ltd.

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Training Courses: aeroflex and 2,5 (1)

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

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Events Calendar: aeroflex and 2,5 (1)

16th International Conference and Exhibition on DEVICE PACKAGING

Events Calendar | Mon Mar 02 00:00:00 EST 2020 - Thu Mar 05 00:00:00 EST 2020 | Fountain Hills, Arizona USA

16th International Conference and Exhibition on DEVICE PACKAGING

International Microelectronics Assembly and Packaging Society (IMAPS)

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Express Newsletter: aeroflex and 2,5 (21)

Partner Websites: aeroflex and 2,5 (246)

New Extrusion Coating Die Eliminates Edge Bead and Enhances Coat Weight Uniformity for Korean Maker

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-ES/divisions/polymer-processing-systems/news/news/2015-01-05

New Extrusion Coating Die Eliminates Edge Bead and Enhances Coat Weight Uniformity for Korean Maker of Flexible Packaging | Nordson POLYMER PROCESSING SYSTEMS Polymer Processing Systems

ASYMTEK Products | Nordson Electronics Solutions

Pipe Insulation & Tubing Insulation

ORION Industries | http://orionindustries.com/pdfs/TUBING.pdf

Pipe Insulation & Tubing Insulation PIPE & TUBING INSULATION Flexible Insulation for HVAC & R Applications ORION professionals are dedicated to the design and production of high quality insulation for all types of industrial and process tubing and pipe

ORION Industries

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aeroflex and 2,5 searches for Companies, Equipment, Machines, Suppliers & Information

Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

Training online, at your facility, or at one of our worldwide training centers"
SMTAI 2024 - SMTA International

High Resolution Fast Speed Industrial Cameras.
Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

Reflow Soldering 101 Training Course
Assembly Automation Technology

Training online, at your facility, or at one of our worldwide training centers"