New SMT Equipment: ag3.0 (2)

AMTECH Premium Cast Bar Solder

AMTECH Premium Cast Bar Solder

New Equipment | Solder Materials

AMTECH’s Premium Bar Solder is designed to meet today’s sophisticated electronic manufacturing processes by providing a strong and reliable solder joint. All AMTECH bar solder is manufactured from a variety of high purity virgin metals that exceed th

AMTECH

Auto Infrared IC Heater Reflow Oven T962C

Auto Infrared IC Heater Reflow Oven T962C

New Equipment | Reflow

Quick Overview Max 400×600 mm soldering area Infrared ic heater T962C works automatically by micro-computer control. Can satisfy a dissimilarity SMD、BAG Soldering a request. Whole soldering process to complete automatically, easy to use, Adoption

1 CLICK SMT TECHNOLOGY CO., Limited

Electronics Forum: ag3.0 (6)

90/10 & Lead Free Solder Balls

Electronics Forum | Mon Mar 26 10:40:14 EDT 2007 | solderiron

WaveroomPlus can offer the following Sn95.5 Ag3 Cu0.7 Sn95.5 Ag4 Cu0.5 Sn96.5 Ag3.0 Cu0.5 Sn97 Ag2.5 Cu0.5 Steve@waveroomplus.com

Lead Free paste

Electronics Forum | Wed Nov 08 08:12:16 EST 2006 | jnaligan

hi... try evaluating eco solder paste Sn96.5/Ag3.0/Cu0.5 from Senju... output is good and i suggest your stencil's apperture ratio with the pad 1:1 when it comes to fine pitches...and BGA pads regards, janry

Industry News: ag3.0 (5)

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste

Industry News | 2015-10-13 19:27:42.0

SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (

Shenmao Technology Inc.

Videos: ag3.0 (1)

Dyfenco Solder Wire

Videos

Product name: Halogen Free Lead Free Solder Wire Product code: E9650-HF961 Alloy composition: Sn/Ag3.0/Cu0.5 Diameter: 0.2mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm Packing: 500g/reel, 1kg/reel (10kg/box) Price: Contact us for best price Features:

Dyfenco International Co., Ltd.


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High Throughput Reflow Oven
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World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India