Electronics Forum | Fri Apr 20 18:21:55 EDT 2007 | Hegemon
Consider how the vast majority of PCBs with BGAs are produced. Forced air convection. Anything that comes closer to duplication of the original soldering profile is what you desire. Did they build it with IR or Convection? The process engineer wa
Electronics Forum | Tue Jun 26 15:36:57 EDT 2007 | bjrap3
The board thickness is 50 thousandths. The style of the BGA is a 324 ball BGA that has an isolated center region. The machine that I am using is the Air-Vac DRS25. I'm not too sure why the pads are being removed when I am desoldering. I know when
Used SMT Equipment | Repair/Rework
Air-Vac Engineering DRS 25 Lead Free BGA rework station Windows 10 PC w/DRS25 software Board cooling, IR board temp sensor, Profile Tutor 5 nozzles Complete and Operational Video demonstration available Installation and training available
Used SMT Equipment | Repair/Rework
Air-Vac DRS25 LEAD FREE BGA Rework station • High Efficiency Preheater • Board Carrier: 24" x 24" • Programmable Board Cooling System • Nozzle "Cool Air" Injection • Desktop Computer (Windows XP), Monitor, Keyboard, Mouse • Thermal Tutor Softw
Industry News | 2009-10-13 12:56:51.0
San Diego — October 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, in conjunction with Air-Vac Engineering Company will hold a free BGA Manufacturing and Repair Seminar at 6 p.m. on Friday, October 23, 2009 at the Hotel Radisson Case Grande, Ciudad Juarez in Juarez, Mexico.
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
Demo of the Profile Tutor feature with Auto Build function on the Air-Vac DRS25.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
. Tested in Air atmosphere and Nitrogen at 1000 ppm oxygen using a tent shaped profile No Lead Solder Paste Profile (Alternative Approach – Preferred in Japan
| http://etasmt.com/te_news_bulletin/2020-05-04/15961.chtml
When the PCB board enters the reflow oven zone, the temperature in the furnace rises rapidly to melt the solder paste, and the liquid solder forms solder joints to the components
