Si-Al alloy with a CTE of 6.7ppm/C. This can be supplied as plate or block, or machined and plated to a finished component. Used in satellite microwave packages, avionics, PCIMs etc.
MPL-A310F-MJ24AA MPL-A310F-MK22AA MPL-A310F-MK24AA MPL-A310F-SJ22AA MPL-A310F-SJ24AA MPL-A310F-SK22AA MPL-A310F-SK24AA MPL-A310P-HJ22AA MPL-A310P-HJ24AA MPL-A310P-HK22AA MPL-A310P-HK24AA MPL-A310P-MJ22AA MPL-A310P-MJ24AA MPL-A310P-MK22AA
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan
There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior
Meeting Heat And CTE Challenges Of PCBs And ICs News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Meeting Heat And CTE Challenges Of PCBs And ICs The electronics industry
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
standard failure analysis techniques. A similar effect due to planar voiding was reported for mechanical reliability testing performed by Mukadam et al [10
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Process Engineer, Garmin AT 2012 Xian Qin , Georgia Institute of Technology Paper: "Highly Reliable Low CTE Interposer to Printed Wiring Board SMT Interconnections" Where is she now
