Industry Directory | Manufacturer
Cookson Electronics is a leading materials science company that provides high performance materials, Soldering Pastes
Dynapert, Universal, TDK, Spare Parts, Bandoliering Tape, Auto-Insertion and SMT Machine , Sanyo, Fuji, Iemme, Yokota, Electrovert, Taiwan, V12000, UCSM-G, VCD, Titanium Fingers For Wave Soldering Machines, Sensbey, Engineering Services For PCBA mac
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
Electronics Forum | Tue Jun 07 12:07:30 EDT 2016 | wlsmt
Sorry davef. I was not being clear. PCBAs came out cold soldered after being reflowed the first time with ALPHA WS-820. The flux gel ALPHA WS 609 was supposed to be applied only onto the terminations of caps where ALPHA WS-820 was for a second refl
Electronics Forum | Wed Jun 15 10:38:41 EDT 2016 | laynefelix
Hi everyone..i am new here. I am hardware design engineer and as per my experience PCBAs came out cold soldered after being reflowed the first time with ALPHA WS-820. The flux gel ALPHA WS 609 was supposed to be applied only onto the terminations of
Used SMT Equipment | Soldering - Selective
ACE KISS-104 Dual Pot Selective Solder System; Includes: (1) Lead Free & (1) Leaded Solder Pot; Vintage: Sept. 2008;; Nitrogen; Top Pre-heater; Setup & Witness Cameras, Manual, (3) Rolls of Alpha Metals Solder and Tool Kit
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2019-08-04 20:30:07.0
IPC's Validation Services Program has awarded and renewed an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to ALPHA-electronik A/S, an ISO9001 and ISO13485 certified EMS-based company in Denmark. Following an IPC audit, Alpha-electronics became the first European company to successfully renew and complete an intensive audit, based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
ALPHA® Preforms with solder paste adds solder volume.
Adding ALPHA® solder preforms to solder paste can result in complete hole fill in electronic assembly pin in through hole soldering applications. www.alpha.alent/products/preforms
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | kerala, any ware India | Production
i have experience in • Operation of wave soldering and water cleaning machine • Inspection ( Reflow and Post Wave ) • Pre Reflow inspection in SMD • Component forming stuffi
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
on volume delivery and positioning accuracy for solder p
1st Place Machinery Inc. | http://www.firstplacemachinery.com/index.html
, Philips Comet , ERSA EWS 500F , Vitronics Alphwave , Vitronics Dover Soltec 6622CC , GPD CF9 , ERSA Wave Solder , MPM UP2000 Screen Printer , SEHO 1135F
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf
Surface Mount Technology Association (SMTA)
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