Industry Directory: any md 200 (16)

KB Electronics Inc.

Industry Directory | Manufacturer

Manufacturer of AC/DC Drives

Avanti Circuits

Industry Directory | Manufacturer

When you purchase from Avanti you are dealing directly with a US based manufacturer with full in house capabilities and a management staff with over 200 years of combined PCB manufacturing experience.

New SMT Equipment: any md 200 (869)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

Electronics Forum: any md 200 (386)

200 pin connector reflow

Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl

You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get

solder paste for 200 degs c continuous operation?

Electronics Forum | Wed Mar 21 10:37:02 EDT 2012 | torch

we are currently developing a 180 degs downhole tool and are right at the limits of our current solder paste, the tool has mostly surface mount parts and some fine pitch ic's. i was wondering if anyone had any recomendations for a suitable solder pas

Used SMT Equipment: any md 200 (232)

Mydata My100, My200 or My300

Mydata My100, My200 or My300

Used SMT Equipment | Pick and Place/Feeders

We have an immediate need for Mydata My100, MY200 and My300 SMT Pick & Place machines. Any model year is acceptable.

Baja Bid

Mydata MY200SX-14

Mydata MY200SX-14

Used SMT Equipment | Pick and Place/Feeders

More information:https://bajabid.com/product/2014-mycronic-my200sx-14/ This machine is avalable for immediate purchase. Please contact us with any interest. (813) 992-2437.

Baja Bid

Industry News: any md 200 (405)

Merix Corporation Updates Guidance for the Third Quarter of Fiscal 2003

Industry News | 2003-01-31 09:39:08.0

Expected to be Below the Guidance Provided During the Company's Earnings Conference Call on December 18, 2002

SMTnet

Cadence Announces Aptivia Parallel Characterization Option

Industry News | 2003-06-02 09:14:01.0

Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x

SMTnet

Parts & Supplies: any md 200 (1260)

Yamaha Used  FEEDER POWER LOADING UNIT

Yamaha Used FEEDER POWER LOADING UNIT

Parts & Supplies | Pick and Place/Feeders

KHJ-MD200-000 YAMAHA  FEEDER POWER LOADING UNIT More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YG200 201 Nozzle

Yamaha YG200 201 Nozzle

Parts & Supplies | SMT Equipment

YAMAHA YG200 201 Nozzle Pls kindly contact with us at any time, if you are insterest more info about products. Website : www.ksunsmt.com Email: jenny@ksunsmt.com Skype:jenny@ksunsmt.com MP: 0086-15629932323 What's app: 15629932323

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: any md 200 (2)

Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress

Technical Library | 2015-05-21 18:46:31.0

In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.

CALCE Center for Advanced Life Cycle Engineering

Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages

Technical Library | 2020-09-23 21:37:25.0

The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.

Nihon Superior Co. Ltd

Videos: any md 200 (1432)

?Panasonic NPM-D3 Modular SMT Placement

?Panasonic NPM-D3 Modular SMT Placement

Videos

​Panasonic NPM-D3 Modular SMT Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, P

Dongguan Intercontinental Technology Co., Ltd.

Panasonic SMT Chip Mounter Machine

Panasonic SMT Chip Mounter Machine

Videos

​Panasonic NPM-W2 Modular SMT Chip Mounter Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: any md 200 (4)

Continued Journey of Equality Expo

Events Calendar | Wed Apr 28 00:00:00 EDT 2021 - Wed Apr 28 00:00:00 EDT 2021 | ,

Continued Journey of Equality Expo

Surface Mount Technology Association (SMTA)

Advanced Design & Manufacturing Cleveland

Events Calendar | Wed Mar 13 00:00:00 EDT 2019 - Thu Mar 14 00:00:00 EDT 2019 | Cleveland, Ohio USA

Advanced Design & Manufacturing Cleveland

UBM Canon

Career Center - Jobs: any md 200 (5)

Account Sales SMT Mid-Atlantic

Career Center | Bedford, Texas USA | Sales/Marketing

Sell SMT/PCBA capital equipment in S.NJ, MD, PA, and DC area. Candidate will be calling on any potential account and focusing on two major established accounts there. Candidate should have a recent and significant succesful track record in selling

Bower & Associates

Sales Manager - Bay Area

Career Center | , California USA | Sales/Marketing

$150-200K 1st years income - CEM Sales! DCSI is an International Executive Search Firm specializing in the CEM, OEM, & ODM industries with emphasis on Medical, Automotive, Design, Consumer, Telecom, and Industrial busines sectors. We currently have

DCSI Consultants

Career Center - Resumes: any md 200 (16)

Safety Professional

Career Center | Savannah, Georgia USA | Engineering,Human Resources,Maintenance,Management,Production,Quality Control,Research and Development,Technical Support

I’d like to give you a brief overview of my skills and experience.  I am confident that I could bring value to the SMTnet as your Safety Professional.  Here’s how my qualifications meet your requirements: • Military (E-7) Manager with experience as

TECHNICIAN

Career Center | THRISSUR, India | Maintenance,Production

HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&

Express Newsletter: any md 200 (532)

Partner Websites: any md 200 (680)

448796-01 - Enhanced Rail ASSY, MD, 2043, CR Plated

Heller Industries Inc. | https://hellerindustries.com/parts/448796-01/

448796-01 - Enhanced Rail ASSY, MD, 2043, CR Plated Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New

Heller Industries Inc.

MPS1010 MX100 200 0201 Nozzle SMT Nozzles

| https://www.feedersupplier.com/sale-13067781-mps1010-mx100-200-0201-nozzle-smt-nozzles.html

MPS1010 MX100 200 0201 Nozzle SMT Nozzles Leave a Message We will call you back soon! Your message must be between 20-3,000 characters


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World's Best Reflow Oven Customizable for Unique Applications
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Global manufacturing solutions provider

Wave Soldering 101 Training Course