New Equipment | Assembly Services
Turnkey PCB assembly forms a core part of our manufacturing capability. We support all levels of production from low volume prototypes to the ongoing, sustained production requirements needed to get your products to market. Prototype Assembly We
New Equipment | Assembly Services
Shenzhen ZF Electronics Co., Ltd own 6 professional SMT lines ( 6 each of Panasonic HT121 and Yamaha YV100XG), 2 DIP lines, AOI, Automatic solder paste printer, Semi-automatic solder paste printer, Up and down eight-zones reflow soldering, PCBA test
Electronics Forum | Tue Jun 13 23:16:32 EDT 2006 | mrduckmann2000
WE LOOKED INTO THE YESTECH AND THE MIRTECH. TODAY WE ARE INSTALLING OUR NEW MIRTECH AOI MACHINE. WE CHOSE THIS MACHINE OVER THE YESTECH BECAUSE OF IT'S OFFERINGS. THE YESTECH WAS A CLOSE SECOND. I WILL POST LATER ON THE PROGRAMMING, THEY ARE ALL
Electronics Forum | Fri Aug 14 10:51:30 EDT 2009 | rway
If he is the same Martin Gershenson who works for Christopher, then I'de believe he's being sneaky. We demoed one of their units three years ago, along with Mirtech and YesTech. Of the three, they were the only ones who wouldn't let us experiment w
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2013-09-26 18:03:10.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
SMT PCBA X-ray Machine ETA-7900 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt x ray,smt x ray machine,x-ray inspection machine,x-ray d
OurPCB Tech Limited(www.ourpcbte.com) was founded in 2005, We have provided a professional Printed circuit board & PCB Assembly services for more than 2,500 customers around the globel.
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
SMTnet Express, June 11, 2015, Subscribers: 22,861, Members: Companies: 14,392 , Users: 38,338 Solder Paste Stencil Design for Optimal QFN Yield and Reliability B. Gumpert; Lockheed Martin Corporation The use of bottom terminated components (BTC
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Imagineering, Inc. | https://www.pcbnet.com/services/assembly/turn-key/
. We handle the whole process including ordering the components, PCB manufacturing, PCB assembly, testing and final shipment. We are capable of assembling BGA, Micro-BGA, QFN and other leadless package parts
46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf
Heller Industries Inc.
