Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..
Industry Directory | Manufacturer
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Sat Oct 15 19:18:14 EDT 2011 | enttec
Hi Does anyone have a calibration manual for a MPM AP25-Hie ? Have noticed recently that we have a slight mismatch between board and stencil when printing. I have the user manual but we didn't get calibration when we bought this machine Thanks Nic
Electronics Forum | Mon Aug 31 15:39:18 EDT 2020 | jmelson
Yes, the rightmost VME board is the IO_DPRAM, and it also handles the front panel buttons and E-stop inputs to the computer(s). So, reseat the connectors on the front of that board. Also, there may be an interface board on the bottom left (called C
Used SMT Equipment | Pick and Place/Feeders
JUKI FX-3 High Speed Modular Mounter Model FX-3 FX-1R(Conventional model kind) Placement speed (chip) Optimum 0.049Sec./chip(74,000CPH) 33,000CPH*2 （optimum condition） IPC9850 60,000 CPH 25,000 CPH Component size 0402(01005) ～□33.5mm (or dia
Used SMT Equipment | Board Cleaners
• Vintage 2008 • PLC based Control System • 480V AC 60Hz • Auto Stop/Stand by Mode • Final Rinse low flow sensor and alarm • Mach II Drying System • 2 upper, 2 lower jet manifolds • 15 HP blower upgrade • 18” Off Load Extension • Integrated
Industry News | 2017-08-19 13:31:56.0
GPD Global will demonstrate its Hyperion dispense system in booths 1C03 & 1C10 at upcoming NEPCON South China 2017. This fully automated dispense platform incorporates the latest technology from GPD Global in a compact footprint. Equipped with linear motor drives, smart pump technology, full touch screen interface, vision centric system operation & more, this is a dispense system not to be missed.
Industry News | 2016-09-14 20:57:09.0
GPD Global will exhibit and have live demonstrations of the Continuously Volumetric Pump in Booth# 424 at the upcoming SMTA International 2016 Conference and Exhibition.
MPM out board sensors(P2715/P7215) Name: P2715; P7215; CA-553; P1001; MPM out board sensors Part Number: P2715; P7215; CA-553; P1001 Description: P2715; P7215; CA553-4; CA553-5; CA-553; P1001 MPM and out board sensors Applicable models: AP UP P
Parts & Supplies | SMT Equipment
MPM out board sensors(P2715/P7215) Name: P2715; P7215; CA-553; P1001; MPM out board sensors Part Number: P2715; P7215; CA-553; P1001 Description: P2715; P7215; CA553-4; CA553-5; CA-553; P1001 MPM and out board sensors Applicable models: A
Technical Library | 2017-02-01 02:20:42.0
BGA Rework Course encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies. There should be 'one-stop' solution, that offers a wide range of ball grid array rework and repair services.
Technical Library | 2021-07-20 20:02:29.0
During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Events Calendar | Wed Jul 26 00:00:00 EDT 2017 - Wed Jul 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Technical Education - Best Practices in Design
Events Calendar | Tue Jul 11 00:00:00 EDT 2023 - Tue Jul 11 00:00:00 EDT 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | DALLAS, Texas USA | Production
Extensive, diverse background in Production Management and Warehousing in state of the art manufacturing environments. Exceptional ability to translate corporate strategies and orchestrate between business components, resulting in deliverables on ti
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