Industry Directory | Consultant / Service Provider / Manufacturer
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New Equipment | Solder Paste Stencils
For the DIYer, hobbyist or technical researcher there are times where all you need is a simple means to apply solder paste for SMT devices for a few simple boards. In those cases a plastic SMT stencil may be the right solution. Eliminate the tedious
New Equipment | Selective Soldering
MB Manufacturing is proud to announce, we now offer Dedicated Solid Titanium Solder Nozzles for Seho and Pillar House Selective Solder machines. Our innovative designs allow even flow through a variety of apertures. We also offer shutters for fine fl
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2008-03-12 15:38:55.0
Fine Line Stencil invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
SMT Stencil Production with the LPKF StencilLaser G 6080 The LPKF StencilLaser G 6080 is a highly productive and precise SMT stencil laser cutting system. Learn more: http://www.lpkf.com/products/smt-stencils/cutting-smt-stencils-and-microparts.htm?u
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237 Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder Bottom
SMTnet Express, March 13, 2014, Subscribers: 22531, Members: Companies: 13818, Users: 35857 Stencil Design Guidelines for Electronics Assembly Technologies Oliver Krammer; Budapest University of Technology and Economics. A student competition
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/efd/products/solder-paste/printplus-printing-paste
> Informazioni correlate Documentazione PrintPlus Printing Guidelines (Inglese) Guida alla Scelta della Pasta Saldante Carte bianche per Pasta Saldante (Inglese
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Base-Locations-Reference-Guide-22100025.pdf
. To get started verifying or teaching base locations on a GPD Global dispenser, review the following guidelines: • Teaching base locations requires moving or “jogging
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