Electronics Forum | Fri Dec 09 00:19:51 EST 2016 | aqueous
Hi Dean, We are a manufacturer of cleaning equipment. I'm not sure if your machine is one of ours or another brand. Regardless, I am happy to provide assistance. In order to maximize the level of "helpfulness", it would be helpful for me to know mor
Electronics Forum | Fri Dec 08 21:26:44 EST 2006 | billwestiet
You already have some good answers. A chemical isolation zone for RMA is a good idea. If you are looking for new see the two references you have and Austin America. If you are looking for used, see us at http://www.ietechnology.net. We presently
Industry News | 2010-09-20 19:36:19.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2014-10-22 11:22:28.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_board_cleaning_aqueousAQ400CL.html
Aqueous AQ400-CL Aqueous Technologies Batch Cleaner Model Number: AQ400-CL Serial Number: 5198 Closed Loop 7578 Wash Cycles Stainless Steel Chamber Includes Holding Rack for PC Boards and Parts Fully Automatic cleaning and drying cycles 208 - 60HZ - 1 Phase - 10 Amps Tanks Included as shown in pictures
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/news/nordson-asymtek-featured-at-kintner-equipment-corporation-workshop
Nordson ASYMTEK Dispensing and Coating Equipment and Process Technologies to be Featured at Kintner Equipment Corporation Workshop ASYMTEK Products Corporate | Global Directory
