Industry News | 2019-10-17 15:26:25.0
Practical Components announces that it will showcase its advanced technologies in representative AAT Aston’s exhibit at Hall A2 Stand 578 scheduled to take place November November 12-15, 2019 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2020-09-06 04:37:56.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the SEMICON Taiwan Global SiP Summit on September 24, 2020 at 4:20pm. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation 'Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration'.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. Applications for which the (a) profile are appropriate include pastes that require a dwell time at 150° to 160°C to allow for flux activation, and for IR-based ovens that create large temperature differentials (∆T
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
/125 °C profiles. The key findings from the thermal cycling tests and subsequent failure analysis are as follows: ▪ X-ray and metallographic inspections showed that the solder paste was effective at producing extreme voiding in many of the ball locations
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