Industry Directory: aspect ratio (8)

FP STENCIL SDN. BHD.

Industry Directory | Manufacturer

FP Stencil Sdn. Bhd. is principally involved in the manufacture and sale of laser-cut metal surface- mount technology (SMT) stencils. Our products comprise of PCB stencils, wafer stencils, mini stencils, & accessories.

Sierra Circuits Inc.

Industry Directory | Manufacturer

A printed circuit board manufacturer producing high quality prototype printed circuit boards.

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New SMT Equipment: aspect ratio (12)

Straight Fin BGA Heat Sinks

Straight Fin BGA Heat Sinks

New Equipment | Other

Straight Fin BGA Heat Sink (High Aspect Ratio Ext.) High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduc

Advanced Thermal Solutions, Inc

Slant Fin BGA Heat Sinks

Slant Fin BGA Heat Sinks

New Equipment | Other

Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extruded aluminum, which minimizes thermal resistance from th

Advanced Thermal Solutions, Inc

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Electronics Forum: aspect ratio (155)

Re: aspect ratio for massive components on the solder side of double-sided reflowed PCBs

Electronics Forum | Thu Oct 19 16:10:44 EDT 2000 | John Thorup

Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.

Re: aspect ratio for massive components on the solder side of double-sided reflowed PCBs

Electronics Forum | Thu Oct 19 16:10:48 EDT 2000 | John Thorup

Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.

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Industry News: aspect ratio (55)

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

IPC Honors Best Technical Paper at Annual Meeting

Industry News | 2001-10-18 11:52:16.0

IPC has announced the winner of this year's IPC Annual Meeting Best Technical Paper award. Mike Kittelson and Jess L. Pedigo, from Honeywell Advanced Circuits, received the Best Technical Paper award for A Review of Filling High Density, High Aspect Ratio Vias in A High Volume Printed Circuit Board Industry.

Association Connecting Electronics Industries (IPC)

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Technical Library: aspect ratio (7)

Wafer-Level Packaged MEMS Switch With TSV

Technical Library | 2012-02-02 19:09:53.0

A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S

The Foundation for Scientific and Industrial Research - SINTEF

PTH Core-to-Core Interconnect Using Sintered Conductive Pastes

Technical Library | 2013-03-07 18:25:36.0

The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings

Ormet Circuits, Inc.

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Videos: aspect ratio (1)

PNC - Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

PNC - Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

Videos

Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

PNC Inc.

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Events Calendar: aspect ratio (1)

Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour

Events Calendar | Tue Jul 11 00:00:00 EDT 2023 - Tue Jul 11 00:00:00 EDT 2023 | Oshkosh, Wisconsin USA

Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour

Surface Mount Technology Association (SMTA)

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Career Center - Jobs: aspect ratio (1)

SMT Manufacturing Engineer - 2nd Shift

Career Center | Houston, Texas USA | Engineering,Management,Production

SMT Manufacturing Engineer – 2nd Shift Hunting Innova is a Houston based company serving industrial, energy, medical, defense and aerospace segments of the Electronic Manufacturing Services (EMS) Industry since 1989.  Hunting Innova is located in N

Hunting Innova

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Career Center - Resumes: aspect ratio (3)

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

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Express Newsletter: aspect ratio (858)

SMTnet Express - September 28, 2017

SMTnet Express, September 28, 2017, Subscribers: 30,862, Companies: 10,741, Users: 23,873 An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios Jasbir Bath, Tony Lentz, Greg

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Partner Websites: aspect ratio (43)

Barrier Film Die | Nordson Polymer Processing Systems

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/barrier-film-die

  Considerations for design focus are:    Larger aspect ratio for more challenging coextrusion processes Larger preland gaps and longer lip lands prevent coextrusion instability

ASYMTEK Products | Nordson Electronics Solutions

Introduction to SMT Stencils for Printed Circuit Boards-SMT Technical-Reflow oven,SMT Reflow Solderi

| http://etasmt.com/cc?ID=te_news_industry,26765&url=_print

. The aperture size is also relevant since the relation (aspect ratio) between this and the material thickness will determine if the release of solder paste is optimal

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