Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
Industry Directory | Consultant / Service Provider
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach
Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2014-01-29 14:32:03.0
Engineered Material Systems (EMS) debuts its 585-1 Non-Conductive Paste (NCP) designed for flip chip packaging applications.
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Parts & Supplies | Pick and Place/Feeders
Supply JUKI 775 1700 Driver AU6550N1021 Other juki driver: J1080000000 BOLL SCREWDRIVER KD000000010 18000P ENCODER KK000000380 I/O CONNECTOR 50P KK000000530 CONNECTOR 26 POLES KK000000680 CONNECTOR 28 POLES KK000000690 CONNECTOR 28 POLES KK00
 Y driver KM000000030 AU6550N2062_1.jpg)
Parts & Supplies | Pick and Place/Feeders
JUKI 750(760) Y driver KM000000030 AU6550N2062 Other juki driver: J1080000000 BOLL SCREWDRIVER KD000000010 18000P ENCODER KK000000380 I/O CONNECTOR 50P KK000000530 CONNECTOR 26 POLES KK000000680 CONNECTOR 28 POLES KK000000690 CONNECTOR 28 POLE
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
Hyland; Agilent Au over Ni on Cu is a widely used p
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Shatil Haque, Lumileds Lighting (Malaysia) Sdn. Bhd. "Packaging of High-Power LEDs Using Au Stud Bump Interconnects" 2004: Chrys Shea, Cookson Electronics "Optimizing Stencil Design for Lead-free SMT Processing" 2003
