Industry Directory: ausn (1)

Micralyne Inc.

Industry Directory | Manufacturer

Micralyne offers a patented process for electroplating AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness.

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New SMT Equipment: ausn (2)

AuSn Solder Electroplating

AuSn Solder Electroplating

New Equipment | Solder Materials

AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl

Micralyne Inc.

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

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Electronics Forum: ausn (31)

AuSn Alloy Solder Electroplating

Electronics Forum | Wed Sep 29 14:46:59 EDT 2004 | Bryan Smith, Micralyne

I am curious to hear feedback on whether companies that could benefit from a AuSn solder plating process would prefer to bring it inhouse (ie. License) or outsource the plating. I look forward to your comments. Bryan Smith Micralyne www.goldtinsold

AuSn Alloy Solder Electroplating

Electronics Forum | Fri Oct 01 18:12:02 EDT 2004 | Bryan Smith

Hi Greg, You can find details on our AuSn solder plating at http://www.goldtinsolder.com. Call me at 780-431-4412 if you have questions. Take care, Bryan

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Industry News: ausn (20)

Laser Bar Bonding with AuSn or Indium on the New Automatic Sub-Micron Bonder FINEPLACER� FEMTO

Industry News | 2007-11-27 12:28:45.0

FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.

Finetech

Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Industry News | 2016-01-05 14:46:38.0

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

Indium Corporation

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Videos: ausn (1)

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

Videos

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html

Finetech

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Express Newsletter: ausn (1)


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