Industry Directory: automatic die bonder (15)

CMTec AG

Industry Directory | Equipment Dealer / Broker / Auctions

CMTec is highly specialized in dealing with assembly equipment. We support BESI (ESEC, Datacon), Kulicke & Soffa, Hesse & Knipps, F&K Delvotec, Orthodyne, ASM, Dage and others. CMTec delivers 'turn-key' projects worldwide.

Palomar Technologies

Industry Directory | Manufacturer

manufacturer of die and wire bonders

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New SMT Equipment: automatic die bonder (58)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

New Equipment | Assembly Services

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

I.C.T ( Dongguan ICT Technology Co., Ltd. )

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Electronics Forum: automatic die bonder (31)

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Re: flip chip bonder

Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel

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Used SMT Equipment: automatic die bonder (23)

Panasonic BM231

Panasonic BM231

Used SMT Equipment | SMD Placement Machines

  ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand: CP40L; CP40LV; CP45F; CP45FV;  CP45FVneo); YAMAHA SMT mac

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Yamaha Ys12

Yamaha Ys12

Used SMT Equipment | Chipshooters / Chip Mounters

  ETA Electronic equipment CO.,LTD. to provide professional SMT automatic production line solution,The company specializes in SMT chip mounter(New samsung:SM421,SM411,SM100 etc)(second-hand: CP40L; CP40LV; CP45F; CP45FV;  CP45FVneo); YAMAHA SMT mac

I.C.T ( Dongguan ICT Technology Co., Ltd. )

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Industry News: automatic die bonder (146)

GPD Global to Showcase PCD 'H' Series at IMAPS - Long Beach 2011

Industry News | 2011-09-12 12:04:25.0

GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics

GPD Global

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

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Parts & Supplies: automatic die bonder (1)

Panasert Automatic insertion spare part

Parts & Supplies | THT Equipment

X004-221 JOINT X004-223 COLLAR X004-224 SPRING HOLDER BOLT X004-231 PIN X004-244 LEVER X004-246 PLATE X004-248 PUSHER X004-250 LEAD CUTTER X004-255 TAPE CUTTER X004-256 LEAD CUTTER X004-260 ROD X004-266 PIN X004-268 BEARUNG HOLDER X004-269 STOPPER HR

Wisdom Shining Electronic Technology (China) Limited

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Videos: automatic die bonder (63)

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Videos

General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.

Heller Industries Inc.

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

Videos

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

Dongguan Intercontinental Technology Co., Ltd.

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Career Center - Jobs: automatic die bonder (6)

R&D technician

Career Center | San Jose, California USA | Research and Development

Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets.  You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag

Avago Technologies

Mid-Atlantic Regional Sales Manager

Career Center | Philadelphia, New Jersey USA | Sales/Marketing

LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e

Electronics Search Group of MRI

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Career Center - Resumes: automatic die bonder (8)

Experienced Technical Specialist

Career Center | , Philippines | Engineering,Technical Support

Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal

Equipment Maintenance Technician

Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support

                                                 Duties & Responsibilities (Equipment Technician):  Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment.  Conduct Preventive maintenance

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Express Newsletter: automatic die bonder (362)

Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process

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