Electronics Forum | Wed May 17 17:13:47 EDT 2000 | Michael Parker
The MoonMan has spoken. Everybody get back up on the wall, its been long enough that this has been "off the wall". Wish I had more Rambus chips, just got my SMT process dialed in and ran out of stock. Damn.
Electronics Forum | Thu Mar 14 10:49:44 EDT 2013 | babe7362000
Have others seen a higher rate of machine downtime due to the cover tape on parts not pulling back properly. We have the same problem on the Jukis and Quads. About every 3 minutes the machine stops and the operator has to pull the tape back. And in
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2014-09-12 12:59:30.0
Precision PCB Services, Inc. Announces their LIVE Interactive Broadcast Series on BGA Component Rework.
Parts & Supplies | Pick and Place/Feeders
Single pendulum on JUKI FF 16MM feeder wheel 40001982 OCC A LIGHT PCB ASM 40002065 Y-AXIS LMT CABLE ASM 40002066 X-AXIS LMT CABLE ASM 40002068 YL LMT SENSOR ASM 40002069 +YL LMT SENSOR(TRAY)ASM 40002070 +YL LMT SENSOR(FEEDER)A 40002072 HEAD
Parts & Supplies | Pick and Place/Feeders
supply all yamaha feeder parts, made in China, good quality KW1-M1540-00X ,TOP COVER ASSY, 0603/0201 KW1-M1185-00X AIR CYLINDER 8mm Feeder KW1-M1113-00X BACK POSITIONING PIN (AIR) KW1-M1112-00X FRONT POSITIONING PIN KW1-M111E-00X SPRING SPR
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Mx400L has an IPC 9850 speed of 42,000 CPH. It will accomodate a PCB size up to 26.77" x 18.11", it has 6 module heads on the front gantry, 6 module heads on the rear gantry. minimum lead pitch is 15mil, and it will place parts down to 01005 (0402 me
SunzonTech’s PCB magazine loader machine provide secure and caring to handling printed circuit board involving SMT manufacturing. It will treat your printed circuit board with smooth and stable way. We consider lots for producing our PCB magazi
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COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
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