New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
New Equipment | Rework & Repair Equipment
The BEST PCB circuit trace repair kit gives you the tools you need for fast modification and repair of PCB circuit traces. Our online PCB repair training videos, our master instructors along with these materials allows you to meet the original PCB qu
Electronics Forum | Fri Apr 02 09:26:15 EST 1999 | Carol Brumfield
Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive?
Electronics Forum | Fri Apr 02 10:55:00 EST 1999 | Scott McKee
| Does anybody put QFP's on the backsides of boards? Can they be reflowed without falling off? Do you use adhesive? | I've seen QFP's on the backside and yes, they need glued prior to reflow - just a couple of drops on the corners. Scott
Used SMT Equipment | Screen Printers
MPM AP_EXCEL screen printer for sale. - It is 2004 vintage and has 2D inspection option. - it was removed from a production line last week for replacing with a new printer. - Generally it is in working condition but one of the absorbers on the
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2002-04-11 08:38:03.0
A Joint-development Initiative for Environmentally Friendly, "Economically Viable" Wafer Cleaning Technology
Technical Library | 2009-09-09 15:08:19.0
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
PCB pad circuit repair using epoxy. Using multiple angles including overhead and from both right and left angles the BEST instructor staff demonstrates plainly how to repair a PCB pad using the epoxy method. This method is per IPC 7721 4.4.1. http://
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Screen and Stencil Printing Processes for Wafer Backside Coating News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Screen and Stencil Printing Processes for Wafer Backside
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2017-07-released_topic2077.xml
. This should solve any offsetting problems.3D STEP:Updated PTH Radial DiskConnected Model for Resistor, Varistor, and Thermistor familiesConnected Model for Thermistor familySOT23, SOT143, SOT223Fixed a problem with the backside negative Z-axis gull
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Process-View-Recorder-User-Guide-22243002.pdf
. Output from each monitor runs to the video switch, located on the backside of the Process View Recorder / DVR mount. 4. A signal from the dispense system as to which dispensing station (1 or 2
