Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
Industry Directory | Consultant / Service Provider / Other
S.M.C.M. International GmbH, based in Switzerland, offers you diverse and comprehensive solutions in the area of international Debt Collection - Debt Recovery - Credit Management - Dispute Resolution.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Waterjet allows for improved cutting tolerances, improved lead times and the ability to provide highly complex geometry. Using a stream of water with forces of 55,000 PSI yields fast production rates and tool free cutting. Our single head and 4-head
Electronics Forum | Tue Jun 14 08:37:18 EDT 2005 | jdumont
Morning all, just took a look at a new board we just got in and the there are different pad areas under the same BGA. What happened is engineering uses wider trace sizes for some pads and those overlap when more than one go to the same pad. This caus
Used SMT Equipment | Conveyors
Nutek Open LIFO, XXL-size Type: NTM650SXXL Serial Nr.: 2012-0810E01 Year of Manufacture: 2013 Direction: Left to Right Transfer height: 900mm (+/-25mm) PCB size: 50 – 535mm (W)/ 80 -850mm (L) Product thickness: 0.60 – 1.60mm Component Height: Top: 30
Used SMT Equipment | Board Cleaners
Speedline Technologies AquaJet Stencil Batch Cleaner and Resys ClosedLoop System For Sale The wash needs a control board. (Part Description: BL1700 CNTRL 16IN 16OUT) The Part Number to Purchase this board is 20-101-0214. Estimated cost is $349. We h
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
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Parts & Supplies | Pick and Place/Feeders
Size comparison table for JUKI 500-508 nozzle model KE2010——2040 PART No. PART NAME SIZE(mm) REMARKS E3608-729-0A0 #500 ASS＇Y(2-HOLES) 0.5/1.0 E3600-729-0A0 #501 ASS＇Y Φ0.7/Φ0.2 E3601-729-0A0 #502 AS
Parts & Supplies | SMT Equipment
500/501/502/503/504/505/506/507/508 series nozzle for SMT JUKI machine KE2010——2040 PART No. PART NAME SIZE(mm) REMARKS E3608-729-0A0 #500 ASS'Y(2-HOLES) 0.5/1.0 E3600-729-0A0 #501 ASS'Y φ0.7/φ0.2 E3601-729-0A0 #502 ASS'Y φ0.7/φ0.4 E3602-729-0
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Technical Library | 2024-07-24 01:18:03.0
Quad Flat No-Lead (QFN) packages has become very popular in the industry and are widely used in many products. These packages have different size and pin counts, but they have a common feature: thermal pad at the bottom of device. The thermal pad of the leadless QFN provides efficient heat dissipation from the component to PCB. In many cases, arrays of the thermal via under the component is used to dissipate heat from the device. However, thermal vias can create more voids or result in solder protrusion onto the secondary side.
www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
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Size Does Matter – Breaking the Barriers of Wafer Level Packaging-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
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