T40W-1200-6 is a plug and play, fully auto dry cabinet which will be stable at 40C and 15C. Fresh News We will participate Productronica 2015 show. The world’s leading trade fair for electronics development and production. http://www.productroni
Electronics Forum | Mon Mar 26 16:58:53 EDT 2018 | solderingpro
Is there anything stopping you from replacing the flat belt solution to a continuous running steel roller chain conveyor? - From there (depending upon board temperature) you should be able to buffer your boards in a vertical buffer station if neede
Electronics Forum | Tue Nov 29 06:31:51 EST 2016 | shockwave24
Hi all, I just would like to ask if what brand and model of profiler can you recommend for profiling of a Vertical Oven?
Used SMT Equipment | Pick and Place/Feeders
Multiple Fuji CP Chipshooters Available. www.xlineassets.com AUCTION ITEMS Jabil Liquidation Including Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18 Rework System Flexlink Transfer C
Used SMT Equipment | Pick and Place/Feeders
Universal Genesis Pick and Place Systems www.xlineassets.com - AUCTION ITEMS JABIL LIQUIDATION Featured Equipment: St. Petersburg, FL Universal Genesis 4988C With FlexJet 3 Heads Universal Genesis 4990B With Lighting Head Air-Vac DRS 18 R
Industry News | 2013-06-10 17:08:51.0
GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company's new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2024-01-16 22:29:59.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components.
Check more detail for PCB buffer: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/96.html multi-function PCB buffer and the SPI/AOI buffer as the SMT buffer stocker that can cache AOI or SPI and other testing machine out of the NG
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Cut and bend machine for taped axial components. axial component lead former be often used the axial resistance and diode. This is the motorized type former, you can use this axial lead f
Events Calendar | Thu Aug 31 00:00:00 EDT 2017 - Thu Aug 31 00:00:00 EDT 2017 | Shenzhen, China
NEPCON and Smart Factory 1.0—The Future of Electronics Manufacturing
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/vertical-resistor_topic2341_post9633.html
: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 4975 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Topic: Vertical Resistor Posted: 23 May 2018 at 9:39am You must create this part in FP Designer as a round body and remove the courtyard because the one hole with distort the courtyard
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/vcd-710-slide-vertical-r-h-225849?page=226&order=name+desc
Slide Vertical - R.H. | Qinyi Electronics Co.,Ltd × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Slide Vertical - R.H
