Industry Directory: baking new pcbs (57)

New England CM, Inc.

Industry Directory | Manufacturer

New England CM is a contract manufacturer for high speed assembly of SMT and mixed technology PCBs specializing in prototype and medium production runs.

Ecological Technologies, Inc.

Industry Directory |

EcoTech distributes new and reprocessed plastic IC trays for use in the testing, baking, handling and shipping of Surface Moount ICs.

New SMT Equipment: baking new pcbs (49)

FKN Systek K5000 - Multiple Blade Circular Blade PCB Depanelizer

FKN Systek K5000 - Multiple Blade Circular Blade PCB Depanelizer

New Equipment | Depaneling

FKN Systek K5000 - Manual board feed PCB multiple panel singulation Singulate panels with up to 10 scorelines. Singulate panels with components up to 2.5" 3 models available: - Output tray - Straight output conveyor - Right angle output

FKN Systek

IPC-A-610G Standard

IPC-A-610G Standard

New Equipment | Education/Training

IPC A-610G Acceptability of Electronic Assemblies. The 610 is the industry standard for the acceptance criteria for assembled PCBs. It is also the instructional book used when teaching IPC-A610 CIS students. Revision G has lots of new photos and i

BEST Inc.

Electronics Forum: baking new pcbs (329)

baking out pcbs after reflow process

Electronics Forum | Wed Jul 11 22:44:50 EDT 2012 | joeion

Why cannot reply????

baking out pcbs after reflow process

Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion

It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.

Used SMT Equipment: baking new pcbs (16)

ASM Siemens SIPLACE SX

ASM Siemens SIPLACE SX

Used SMT Equipment | Pick and Place/Feeders

With the SIPLACE SX we have made our most successful placement solution even better: Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily The SIPLACE SpeedStar for high-speed and placement of component

Qinyi Electronics Co.,Ltd

ASM Siemens SIPLACE SX

ASM Siemens SIPLACE SX

Used SMT Equipment | Pick and Place/Feeders

With the SIPLACE SX we have made our most successful placement solution even better: Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily The SIPLACE SpeedStar for high-speed and placement of component

Qinyi Electronics Co.,Ltd

Industry News: baking new pcbs (1066)

No Solder Required for Press-fit D-subs

Industry News | 2003-04-08 10:28:06.0

A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.

SMTnet

PNE PCB to Start Pilot Runs at New China Plant

Industry News | 2003-02-11 08:25:21.0

Commercial Production Will Begin in April

SMTnet

Parts & Supplies: baking new pcbs (10)

Yamaha Pick and place machine

Yamaha Pick and place machine

Parts & Supplies | Pick and Place/Feeders

- Two new placement head types in an evolution of the “1-head solution” to achieve high productivity: Accommodates super-small 0201 (0.25 x 0.125 mm) size components and large components - Extended detection range of components held for

Qinyi Electronics Co.,Ltd

Juki JUKI KE3020 SMT Machine Head Vacuum Unit New Compatible PN 40071585

Juki JUKI KE3020 SMT Machine Head Vacuum Unit New Compatible PN 40071585

Parts & Supplies | General Purpose Equipment

JUKI KE3020 SMT Machine Head Vacuum Unit New Compatible PN 40071585 We long time supply JUKI original Spare Parts, such as feeders, nozzles, filters, valves, motors, lasers,etc. We also can offer repair service for SMT Motors, SMT Drivers, SMT

KingFei SMT Tech

Technical Library: baking new pcbs (17)

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Technical Library | 2018-09-21 10:12:53.0

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.

National Physical Laboratory

Videos: baking new pcbs (56)

2021 brand new High quality SMT Automatic magazine pcb loader Unloader for SMT Assembly

2021 brand new High quality SMT Automatic magazine pcb loader Unloader for SMT Assembly

Videos

Product introduction: 1.This equipment is used to collect PCBs into magazine at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control interface; 4.The pneumatic clamps of top and botto

Shenzhen Honreal Technology Co.,Ltd

The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.

The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.

Videos

The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.

ITW EAE

Training Courses: baking new pcbs (1)

Events Calendar: baking new pcbs (8)

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Surface Mount Technology Association (SMTA)

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Surface Mount Technology Association (SMTA)

Career Center - Jobs: baking new pcbs (15)

Bakery Chef or business

Career Center | , South Jersey USA | Production

I know this has nothing to do with electronics, but if any of you in New Jersey, or Philly, want to start your own Italian Deli Bakery business, here's a chance to get into a restaurant. I wish I had a company that would let me sell them products o

PC Recruitment

SMT Technician

Career Center | Brockton, Massachusetts USA | Production

Responsible for the programming, setup, complete maintenance, and troubleshooting of circuit board assembly line equipment and processes including, but not limited to, surface mount assembly machines, screen printer, pick and place machine, reflow ov

SIE Computing Solutions, Inc.

Career Center - Resumes: baking new pcbs (29)

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

SR quality Eng

Career Center | san jose, California USA | Engineering

Process Eng, Quality supllier, Fianl QA PCBA, BOX build , SAP, Agile, Excell , mir sof word.box build product

Express Newsletter: baking new pcbs (842)

Partner Websites: baking new pcbs (533)

S100 New

FKN Systek | http://fknsystek.com/8DSK7000.pdf

S100 New K7000 PCB DepanelizerK7000 PCB Depanelizer Placement of components to edge. > .04" (1mm) for standard components > .08" (2mm) for sensitive components

FKN Systek

VSS-6 Vacuum Storage System for PCBs | Nordson MARCH

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/products/legacy-products/vss-6-vacuum-storage-system-for-pcbs

VSS-6 Vacuum Storage System for PCBs | Nordson MARCH MARCH Products Corporate | Global Directory | Languages Division Only All of Nordson SEMI Systems AP Batch Series TRAK Automated Series SPHERE Wafer Series PCB Systems VIA High Volume Series ModVIA Expandable Plasma System Plasma Applications

ASYMTEK Products | Nordson Electronics Solutions


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