Electronics Forum | Sat Apr 25 07:10:01 EDT 1998 | JoSi
Hi, A collegue of mine, working on incoming inspection departement, asked me if I know any good standard,preferrable on CD-ROM with high-quality images of different defects that can be found on bare pcb`s. I know IPC-standards, but is there any
Electronics Forum | Sat Apr 25 09:13:26 EDT 1998 | Earl Moon
| Hi, | A collegue of mine, working on incoming inspection | departement, asked me if I know any good standard,preferrable | on CD-ROM with high-quality images of different defects | that can be found on bare pcb`s. | I know IPC-standards, but i
Industry News | 2003-04-29 07:30:06.0
Announce their plans to co-sponsor a free online conference on the current state of bare die packaging
Industry News | 2022-05-27 14:34:04.0
From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
PCB vacuum suction loader/SMT vacuum loader for loading bare board on PCB assembly line: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/123.html ASCEN PCB vacuum loader we produced is mainly used for the beginning of the SMT produc
PCB magazine loader and PCB magazine unloader loading orunloading the PCB board on assembly line, check the detial for: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html multi magazine PCB loader is used at the starting of the
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