Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
MIRTEC: Automated Optical Inspection Systems Tabletop and In-Line AOI Systems 15 Megapixel 2D/3D MV9 AOI Series Five Camera Technology 2D/3D Inspection Capability / 3D OMNI-VISION / 6 Phase Color Lighting System Intelli-Scan For Lift
ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide. Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref
Electronics Forum | Wed Dec 27 17:13:28 EST 2000 | John K.
As part of an Intel erratum, they changed their BGA coplanarity spec from .006" to .008". The package is 23 X 23 partial array, .050"(1.27) pitch, 1.220"(31) square. We apply paste onto BGA pads with a 6-mil stencil. From a process perspective, sh
Electronics Forum | Fri Mar 21 02:45:45 EST 2003 | emeto
Hi, there is one very important thing.How many boards came out with exatly the same problem?
Used SMT Equipment | Chipshooters / Chip Mounters
1999 Fuji IP-III SMT Pick & Place Note: This lot contains two items. (1) Fuji IP-III SMT Pick & Place Approx Dimensions: 126" x 78" x 78" (1) Fuji MTU-4R Tray Tower Approx Dimensions: 43" x 87" x 70" Location: Jasper, IN USA Serial: 1514 Features: o
Used SMT Equipment | AOI / Automated Optical Inspection
MIRTEC MV-7U AOI, MV 7 Series In-Line AOI Machine • In Line Type Vision Inspector for Large Boards• Windows 7 Intel Core2 Duo PC• Five Camera In-Line AOI System• 10 MP cameras with ISIS Vision• 13.4 micron um/pixel Telecentric Compound Lenses• Board
Industry News | 2003-04-17 11:32:31.0
Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
_1.JPG)
JUKI FX-1 E2155725000 AWC BELT (M L) E21517150A0 FRONT RAIL S ASM. E2151723000 RUBBER RING E2151725000 AWC BRACKET F E2151802000 STOPPER BRACKET RA E21527150A0 REAR RAIL S ASM. E2152721000 DRIVE SHAFT C E21527230B0 PAD BLOCK ASM E2152729AA0
Parts & Supplies | Component Packaging
L140E321000 Y CABLE BEAR FX-1R JUKI Smt Pcb Assembly Equipment JUKI E2047700000 CT BELT F JUKI E2047721000 DRIVE PULLEY F JUKI E2047725000 RAIL PLATE FL JUKI E2048700000 CT BELT R JUKI E2048721000 DRIVE PULLEY R JUKI E2048725000 RAIL PLATE F
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/combining-2d-and-3d-aoi-the-most-effective-inspection
. Coplanarity issues are also prevalent on smaller chip components (i.e.01005), leaded devices and BGA packaged devices. In order to attain the highest level of quality assurance (QA
AATEC Ltd | https://aatec.ch/mc-lisa-pick-n-place.php
: Coplanarity inspection Vision Cropping & forming Laser marking Assembly process Test & sorting Typical components to be handled: QFN, QFP, BGA, LQFP, TSSOP, LQFP, SOIC, PLCC, SO, etc
winsouce.jpg)
