Industry News: bga crack parallel to pad (7)

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit at Productronica India 2011

Industry News | 2011-09-01 21:35:02.0

Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd. will showcase a new, expanded range of SN100C products in booth 1060 at the upcoming Productronica India 2011 exhibition

Nihon Superior Co., Ltd.

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Express Newsletter: bga crack parallel to pad (580)

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Pad Cratering - The Invisible Threat to the Electronics Industry

Pad Cratering - The Invisible Threat to the Electronics Industry SMTnet Express September 6, 2012, Subscribers: 25455, Members: Companies: 8972, Users: 33613 Pad Cratering - The Invisible Threat to the Electronics Industry First published

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Partner Websites: bga crack parallel to pad (23)

SMT Reflow Oven Reflow soldering process-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmi

| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print

.  It is recommended to have at least one thermocouple located on a pad towards the edge of the PCB and one thermocouple located on a pad towards the middle of the PCB

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

. The pressure caused by the steam can crack the components with some cracks being so severe they propagate to the exterior.   Preheat The process of stabilizing the work to be soldered at a temperature below the solder melting point

ASYMTEK Products | Nordson Electronics Solutions

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