Industry Directory | Consultant / Service Provider / Manufacturer / Research Institute / Laboratory / School
SMT & PCBA Laboratory Services, X-ray inspection, BGA rework, BGA Reballing, Solder Failure Analysis, SMT Assembly Process Validation, SMT Assembly Process Training & Consulting.
Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
Removable BGA Heatsinks With Revolutionary �EZ Snap� Clip - Easily Installed - Eliminates complex assemblies - Omni directional airflow to maximize heat dissipation - �Round Pin� Heatsinks out perform Crosscuts and Plate Fin Heatsinks in most appli
PROCESS SCIENCES, INC. (PSI) Visit our main Laboratory Services page for more information. Failure Analysis, Material & Process Qualification. We are an analytical services laboratory dedicated to the electronic circuit assembly, printed circu
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Tue Sep 26 16:44:18 EDT 2006 | df
All, We have a board that has failed at burn in. There is a 672 BGA on the board. When the test guy presses down on the BGA the board will pass ! What am I looking at here? Board finish is ENIG - could this be black pad / what should I do to diagn
Used SMT Equipment | X-Ray Inspection
• Nordson DAGE VR950 new technology, open, transmissive X-ray tube: -All voltages can reach <0.95 micron feature resolution – The highest voltage is 160KV, target power: 3W -Long service life of filament components -Automatic st
Used SMT Equipment | In-Circuit Testers
SPEA 4040 Flying Probe with Boundry Scan Model: FP 4040 HI-LINE SERIES 5 Flying Probe Tester Year: 2004 S/N: SWE537FF 4040 Hi Line; high speed high accuracy (1) DRIV-10 V/I Generator; Precision Driver, 4Q, +/-10V, +/- 1A (1) Boost-80 V/I Gene
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
Highly flexible, multi-axis inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis X-ray transmission in the smallest of space with maximum speed and in high resolution. This technology is especially
Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | Elkridge, Maryland USA
SMTA Capital Chapter: Non-Destructive BGA/Area Array Component Rework
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Career Center | Austin, Texas USA | Production,Quality Control
Join an exciting downstream, solid pre-IPO company in the rolling hills of Austin. Work alongside an elite team of engineers with an excellent track record of success in the telecom industry! Their high-performance networking product technology is g
Career Center | Huntington Beach, California USA | Engineering
Trantronics, Inc. A well-established electronics assembly company who specializes in outstanding customer services and on time delivery is seeking a motivated hardworking individual to john our team at the Hunting Beach location. Responsibilities
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
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. lC pin pitch has developed to 0.5mm, 0.4mm, 0.3mm, BGA has been widely used, CSP has also emerged, and shows a rapid upward trend, no-clean, low-residue solder paste on materials has been widely used
