Electronics Forum | Wed Sep 14 15:42:45 EDT 2011 | nowak18
During temperature cycling we have determined that the conformal coating wicking underneath our BGAs has caused fractures in our solder balls. One proposed solution is to run an RTV dam around the parameter of the BGA to prevent the CC from wicking u
Electronics Forum | Wed Aug 15 08:33:31 EDT 2012 | jdumont
Wondering if anyone has ever run across this in their travels. We have gotten a few field returns back in recent months and it appears that many of the balls of the PPC440 CPU BGA (ceramic) have shifted. I know we Xray this part 100% during assy so
Heller Industries Inc. | https://hellerindustries.com/recent-searches/
weld 1707mkv Underfill cure Die attach substrate 1800ecl 1809 mkiii 1808exl Underfill bga 593555 Die attach wire bond Die attach sintering Die attach lead frame 1103d2a3 Curing oven for composites
