Industry Directory: bga separation (3)

AMTECH

Industry Directory | Manufacturer

Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.

PB Technik

Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Standards Setting / Certification / Training Provider

PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ

New SMT Equipment: bga separation (5)

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

Electronics Forum: bga separation (81)

BGA ball Separation

Electronics Forum | Mon Dec 05 08:51:56 EST 2005 | whipping post

no one else has seen this?

BGA ball Separation

Electronics Forum | Mon Dec 05 17:03:15 EST 2005 | russ

Ina ddition to the above it can be from CTE mismatch and the joints are breaking during cooling. Is this an Altera part?

Used SMT Equipment: bga separation (2)

Samsung SM421F

Samsung SM421F

Used SMT Equipment | Chipshooters / Chip Mounters

Make:  Samsung Model: SM421F Vintage:  2012 Details: (4) Spindle Head Assembly “On The Fly” Vertical Alignment Upward Vision Camera for Fine Pitch Components and BGA Ball Inspection Max Feeder Capacity: (120) 8mm Feeders (Feeders available separatel

Lewis & Clark

Panasonic NPM W2 pick and place machine

Panasonic NPM W2 pick and place machine

Used SMT Equipment | Pick and Place/Feeders

FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual

Qinyi Electronics Co.,Ltd

Industry News: bga separation (48)

SMTA International Offers Cost Savings and Technical Excellence

Industry News | 2010-08-09 15:27:51.0

In an effort to accommodate companies recovering from the struggling economy, SMTA is offering valuable free events and cost-saving options for SMTA International attendees in addition to the strong technical conference for which they are renowned. The conference will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida on October 24-28, 2010.

Surface Mount Technology Association (SMTA)

What are the operating steps of the Full-auto SMT Stencil Printer in SMT Production Line?

Industry News | 2022-11-22 06:14:08.0

Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.

Dongguan Intercontinental Technology Co., Ltd.

Parts & Supplies: bga separation (5)

Juki 40000462 ZT BLANK PANEL

Parts & Supplies | Pick and Place/Feeders

JUKI E7126706RAA STOPPER 444R ASM FUJINTAI TECHNOLOGY CO.,LTD JUKI E7126706RAC SUTOPPER 44FR-OP www.fujintai.com JUKI E7150700000 SEPARATE TIMING BELT FUJINTAI TECHNOLOGY CO.,LTD JUKI E71507160A0 FEEDER TYPE 2 www.fujintai.com JUKI E715171600

FUJINTAI TECHNOLOGY CO.,LIMITED

Juki ELBOW UNION PJ304085104

Juki ELBOW UNION PJ304085104

Parts & Supplies | Pick and Place/Feeders

JUKI FX-1(FX-1R) ELBOW UNION PN:PJ304085104 Supply all juki spare parts at a lower price. pls contact us if you have interested. JUKI E6947705000 REEL PRESSURE BASE 12/16 SHENZHEN GREEN TECHNOLOGY CO.,LTD JUKI E6948705000 SHUTTER COVER 12/16 ww

FUJINTAI Technology Co.,Ltd

Technical Library: bga separation (3)

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle

Technical Library | 2019-05-15 22:26:02.0

As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.

Cisco Systems, Inc.

Videos: bga separation (12)

StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method.

StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method.

Videos

StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:

BEST Inc.

DH-A2 automatic BGA rework station for computer and mobile phone repairing

DH-A2 automatic BGA rework station for computer and mobile phone repairing

Videos

Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si

Shenzhen Dinghua Technology Development Co., Ltd.

Training Courses: bga separation (1)

5-Day Hand Soldering, Rework & Repair Certification Training

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Career Center - Resumes: bga separation (1)

SMT QUALITY ENGINEER

Career Center | INDIA, India | Engineering,Quality Control

BACHELOR OF ENGINEERING IN ELECTRICAL AND ELECTRONICS ENGINEERING EXPERIENCE IN SURFACE MOUNT MANUFACTURING TECHNOLOGY.

Express Newsletter: bga separation (489)

SMTnet Express - May 16, 2019

SMTnet Express, May 16, 2019, Subscribers: 31,918, Companies: 10,765, Users: 26,116 Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Credits: Cisco Systems, Inc. As the demand for higher routing density and transfer speed

Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process

Partner Websites: bga separation (40)


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