Industry Directory | Manufacturer
Contract Electronics Manufacturers also providing completely integrated warehousing and logistics services to provide one stop total fulfilment services
Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch
Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean
Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde
Electronics Forum | Thu May 17 09:01:01 EDT 2012 | scottp
I'm not sure why anyone would pay extra for FG (fine grain) stencils. I've run studies comparing traditional YAG laser, fiber laser, and E-form stencils with regular stainless, FG, and nickel foils. YAG is the worse and should only be used for pret
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2021-07-19 16:39:47.0
As today's board complexity increases with more components and joints, higher density, and shrinking package technologies, X-ray inspection is integral to identify manufacturing errors. Understanding the significance of this process, Altus continues to add to its equipment offering with the most advanced inspection systems like X-Spection 6000 which has led to new business.
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
Burnt shrink sleeve information added to section. 11 610 Changes New sections 7.1.8.1 and 7.1.8.2 Connector Mounting Modified 7.2.2.1. Adhesive bonding Modified 7.3.5.1 new criteria for vertical fill of plated through holes for Class 2 products
1st Place Machinery Inc. | http://www.firstplacemachinery.com/index.html
Printer , EuroPlacer Pick and Place , CR Technology RTI 6520 , Tyco Connector Press , Cimtek Test System , Fancort PCB Depaneler , Pace TF2700 BGA Rework Station , Camalot Xyflexpro , Camalot Gemini
