Industry Directory: bga with corners (2)

Tianjin Reains Technologies Co., Ltd

Industry Directory | Manufacturer

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

ALLTEMATED, INC.

Industry Directory | Manufacturer

Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.

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New SMT Equipment: bga with corners (33)

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

New Equipment | Dispensing

The NexJet® 8 Jetting System with patented ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-owner

ASYMTEK Products | Nordson Electronics Solutions

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

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Electronics Forum: bga with corners (475)

Larger lands in corners

Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef

Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad

BGA Warping at the corners

Electronics Forum | Fri Aug 30 11:17:19 EDT 2013 | jth

Hi, the BGA and/or the PCB may be warping excessively during reflow. We offer testing services to measure warpage of BGAs and PCBs during reflow to JEDEC and IPC standards. Let me know if you'd like to learn more about our services: joe@zntechnolo

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Used SMT Equipment: bga with corners (7)

Panasonic high speed chip mounter NPM

Panasonic high speed chip mounter NPM

Used SMT Equipment | SMT Equipment

Product Name:Panasoinc  high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Panasonic original high speed chip mounter NPM

Panasonic original high speed chip mounter NPM

Used SMT Equipment | SMT Equipment

Product Name:Panasoinc  high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

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Industry News: bga with corners (93)

GPD Global's PCD Dispensing on Its MAX Series Platform Recognized with Two 2011 Global Technology Awards

Industry News | 2011-11-20 13:36:13.0

GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform

GPD Global

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?

Industry News | 2018-10-18 10:18:58.0

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?

Flason Electronic Co.,limited

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Parts & Supplies: bga with corners (5)

Juki HX004820000 with repair services

Juki HX004820000 with repair services

Parts & Supplies | SMT Equipment

contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer: 40001570 CPCI BOARD ASM 40001589 LIGHT CTRL BOARD PANEL 40001590 BASE FEEDER POWER BOARD PANEL ASM 40001591 SAFETY POWER BOA

ZK Electronic Technology Co.,Limited

Juki JUKI chip mounter SMT laser JUKI 740 laser E9635725000LA with repair services

Juki JUKI chip mounter SMT laser JUKI 740 laser E9635725000LA with repair services

Parts & Supplies | SMT Equipment

contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer 40045136 LASER SENSOR CONTROLLER ASM E43197170A0 LASER SENSOR BASE ASM E90647170A0 LASER SENSOR CONTROLLER ASM. E960871700

ZK Electronic Technology Co.,Limited

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Technical Library: bga with corners (5)

Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill

Technical Library | 2014-01-02 15:56:55.0

With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.

Jet Propulsion Laboratory

Maximizing Process Control with Controlled Convection Rates

Technical Library | 2007-10-10 23:23:40.0

Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection".

BTU International

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Videos: bga with corners (35)

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Dam and Fill with dual valves. Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity.

Videos

Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

Videos

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

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Training Courses: bga with corners (1)

Design and Manufacturing with SMT-BGA-BTC

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

Ray Prasad Consultancy Group

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Events Calendar: bga with corners (1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

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Career Center - Resumes: bga with corners (1)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

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Express Newsletter: bga with corners (467)

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall

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