New Equipment | Solder Materials
Tokyo, Japan – Koki Company Limited, global manufacturer and supplier of soldering materials, announces the release of new low Ag containing halogen free solder pastes that secures the equivalent joint reliability and heat profile to SAC305, namely S
Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
Electronics Forum | Fri Jan 04 15:42:03 EST 2002 | nwyatt
There are several implications: - some lead free alloys do not form an acceptable solder joint when used with lead contaning paste. (ie. Bismuth) - if you use both lead free and lead containing components, you will have different solder joint compos
Industry News | 2023-01-09 18:39:37.0
With its rule-breaking wave solder alloy, SN100C, Nihon Superior Co., Ltd. earned global recognition as an innovator in lead-free solder formulation. The rule that SN100C broke was that you can't make a Pb-free solder without a silver content that doubles the cost of the raw materials. Now Nihon Superior has broken that rule again with SN100CV, a reflow soldering alloy that can outperform SAC305 in reliability while being reflowable with the same thermal profile as SAC305.
Industry News | 2011-04-29 18:08:57.0
Indium Corporation Technical Support Engineer Ed Briggs will present his technical findings at SMTA Toronto Expo and Tech Forum, Toronto, Canada, May 5, 2011.
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
: Effects of Mixing Solder Sphere Alloys with Bismuth-based Pastes on the Component Reliability in Harsh Thermal Cycling Webinar Jun 23, 2020 Webinar
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. See Nordson EFD printing paste products. Q R Reflow A term used to describe the heating and melting of solder alloy that allows it to flow as liquid again. Reflow Profile A graph of temperature over time experienced by a product during a reflow