ChangDa Composite Materials Manufacturing Co.,Ltd was founded in 2001, it is a comprehensive company that engaged in R&D, production and marketing of thermal insulation and ESD reinforced plastics and solder pallet materials.
Industry Directory | Manufacturer
ZTELEC GROUP, founded in 1958,product including electrical insulation materials, complete transmission and distribution system, enameled wire, 5g electronic communication materials, electrical equipment system, etc
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Trade names: Ricocel Similar Wave Solder Pallet Material, Carbon Fiber Glass Reinforced Sheet Available Shapes: Sheet Color: Black Sheets Thickness: 3mm ~ 80mm Size: 1010×1010mm, 1210×1010mm About Ricocel Similar Wave Solder Pallet Material: It is
Electronics Forum | Wed Oct 12 11:02:59 EDT 2016 | hken
I think stencil manufacturers back fill half etched fiducials with black epoxy or something. I know I've had some worn and that's what I've done for my vision systems to be happy again.
Electronics Forum | Thu Oct 20 12:33:39 EDT 2016 | cyber_wolf
We get our fids laser etched and never have fid read problems. They are black. (see attached) All of our printers are Momentums. Half etch and fill is old school. I used to take 2 part epoxy and mix black printer toner into it and squeegee the mi
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2018-01-28 20:07:34.0
Engineered Material Systems is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.
Low Pressure Molding with Macromelt. Low pressure molding is an innovative manufacturing process between injection molding and potting. A cost effective and environmentally friendly alternative to epoxy potting for fragile electronic components. When
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
